Semi-conductor mounting apparatus for applying adhesive to a substrate
AssigneeEsec AG
InventorsFranco Viggiano, Christof Koster
Life of this patent
Estimating the term…
Loading patent…
AssigneeEsec AG
InventorsFranco Viggiano, Christof Koster
Estimating the term…
An apparatus for applying an adhesive pattern to a chip mounting surface by means of an adhesive dispensing head movable in z, y, and z dimensions, contains a first carriage, which is movable in x and y dimensions using first and second actuators. A second carriage with a dispensing head is movable in the z dimension, perpendicular to the chip mounting surface, on a guide mounted on the first carriage. A third actuator is provided with a positioning motor mounted in a stationary manner and an auxiliary carriage displaceable in the z direction. The auxiliary carriage, driven by the positioning motor, runs in a stationary guide. The auxiliary carriage has a positioning surface parallel to the chip mounting surface and a stop, the stop kept in constant contact with the positioning surface. Preferably, this contact is a gliding contact retained by a spring. The apparatus has good dynamic properties which make possible a rapid "drawing" of adhesive patterns with a high degree of precision.
A semiconductor mounting apparatus for applying adhesive to a chip mounting surface on a substrate, including:
Dependencies are inferred from the claim text.