Method For Detaching And Removing A Semiconductor Chip From A Foil
AssigneeEsec AG
InventorStefan Behler
Life of this patent
Estimating the term…
Abstract
The detachment and removal of a semiconductor chip from a foil occurs in accordance with the invention in three phases. In the first phase there is a partial detachment of the semiconductor chip from the foil with mechanical means, but without the participation of a chip gripper. In the second phase the semiconductor chip is further detached from the foil, with the semiconductor chip being held by the chip gripper. In the third phase the chip gripper is lifted and moved away.
Claims5
1-4. (canceled)
A method for detaching and removing a semiconductor chip from a foil, in which a chip ejector supports the detachment of the semiconductor chip from the foil and a chip gripper takes up the semiconductor chip, with the chip ejector having a support surface on which the foil rests, comprising a first phase without any participation of the chip gripper comprising the steps:
- providing the next semiconductor chip to be removed on the support surface of the chip ejector;
- supplying a vacuum to the chip ejector in order to tightly hold the foil on the chip ejector;
- partially detaching the foil from the provided semiconductor chip with mechanical means, and
- taking a picture of the semiconductor chip and determining its position or deviation of its actual position from its target position, respectively;
- and further comprising a second phase with the steps:
- lowering the chip gripper until the chip gripper touches the surface of the semiconductor chip;
- supplying a vacuum to the chip gripper in order to tightly hold the semiconductor chip;
- further detaching the foil from the provided semiconductor chip with support by the chip ejector,
- and further comprising a third phase with the step:
- lifting and moving the chip gripper away.
Dependencies are inferred from the claim text.