Advanced Semiconductor Engineering, Inc.
Advanced Semiconductor Engineering, Inc. is named on 1 US grants and 254 published applications in this corpus. Its most frequent classification is H10W (Generic packages, interconnections, connectors or other constructional details of devices covered by).
- Granted patents
- 1
- Published applications
- 254
- Inventors
- 309
- Granted in 2026 so far
- 0
- Most recent grant
- 8 Jun 2021
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2001 | 0 | 8 |
| 2002 | 0 | 19 |
| 2003 | 0 | 24 |
| 2004 | 0 | 12 |
| 2005 | 0 | 45 |
| 2006 | 0 | 32 |
| 2007 | 0 | 30 |
| 2008 | 0 | 20 |
| 2009 | 0 | 1 |
| 2010 | 0 | 3 |
| 2011 | 0 | 12 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 1 |
| 2015 | 0 | 1 |
| 2016 | 0 | 5 |
| 2017 | 0 | 24 |
| 2018 | 0 | 16 |
| 2019 | 0 | 0 |
| 2020 | 0 | 1 |
| 2021 | 1 | 0 |
By publication year.
Technology areas
Share of 255 documents
- H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by221
- H05KPrinted circuits49
- H10PGeneric processes or apparatus for the manufacture or treatment of devices covered33
- H10FSolar cells and light sensors16
- Y02PLow-carbon manufacturing16
- Y10TTechnical subjects covered by former us classification16
- G01RMeasuring electric variables8
- B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural6
- B23KSoldering or unsoldering4
- B29CShaping or joining of plastics4
Recent patents
- Semiconductor device package and method of manufacturing the same20 Feb 2020US 2020/0058579 A1
- Semiconductor package9 Aug 2018US 2018/0226320 A1
- Wiring structure, semiconductor package structure and semiconductor process21 Jun 2018US 2018/0174954 A1
- Semiconductor substrate including embedded component and method of manufacturing the same24 May 2018US 2018/0145017 A1
- Semiconductor system and device package including interconnect structure17 May 2018US 2018/0138113 A1
Most cited
By later US patents
None of its patents has been cited by a later US patent yet.