Semiconductor system and device package including interconnect structure
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsChien-Hua CHEN, Teck-Chong LEE, Yung-Shun CHANG
Life of this patent
Estimating the term…
Abstract
A semiconductor device package includes a semiconductor chip, a glass substrate having a first surface facing the semiconductor chip and a second surface opposite to the first surface, the glass substrate defining a hole that traverses the glass substrate from the first surface to the second surface, an interconnect structure disposed in the hole, and a conductive bump disposed adjacent to the interconnect structure and protruded from the second surface, wherein the conductive bump and the interconnect structure include a same material.
Claims20
A semiconductor device package, comprising:
- a semiconductor chip;
- a glass substrate having a first surface facing the semiconductor chip and a second surface opposite to the first surface, the glass substrate defining a hole that traverses the glass substrate from the first surface to the second surface;
- an interconnect structure disposed in the hole;
- and
- a conductive bump disposed adjacent to the interconnect structure and protruding from the second surface;
- wherein the conductive bump and the interconnect structure comprise a same material.
A semiconductor device package, comprising:
- a glass substrate having a first surface and a second surface opposite to the first surface, the glass substrate defining a hole that traverses the glass substrate and comprising a first opening with a first diameter on the first surface and a second opening with a second diameter on the second surface;
- and
- an interconnect structure disposed in the hole;
- wherein the second diameter is greater than the first diameter.
A system for forming an interconnect structure, comprising:
- substrate defining a plurality of holes formed in a surface of the substrate;
- an injecting device, disposed above the substrate, the injection device comprising:
- a slot, configured to be loaded with a conductive material;
- a pumping head disposed adjacent to a top of the slot;
- and
- a filling head, disposed adjacent to a bottom of the slot and configured to fill a selected hole of the plurality of holes to form an interconnect structure;
- wherein the pumping head is configured to pump a gas into the slot and to thereby push the conductive material into the selected hole.
Dependencies are inferred from the claim text.