Semiconductor package
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsIan HU, Jia-Rung HO, Jin-Feng YANG, Chih-Pin HUNG, Ping-Feng YANG
Life of this patent
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Abstract
A semiconductor package includes a substrate, a semiconductor chip and a heat dissipation structure. The semiconductor chip includes a first surface, a second surface opposite to the first surface, and at least one chip pad disposed adjacent to the first surface. The chip pad is electrically connected to the substrate. The heat dissipation structure is disposed adjacent to the second surface of the semiconductor chip and a portion of the substrate. An area of the heat dissipation structure is greater than an area of the semiconductor chip.
Claims22
A semiconductor package, comprising:
- a substrate;
- a semiconductor chip including a first surface, a second surface opposite to the first surface, and at least one chip pad disposed adjacent to the first surface, wherein the chip pad is electrically connected to the substrate;
- and
- a heat dissipation structure disposed adjacent to the second surface of the semiconductor chip and a portion of the substrate, wherein the heat dissipation structure has a first area and the semiconductor chip has a second area, and a ratio of the first area to the second area is greater than about 1.17.
A semiconductor package, comprising:
- a substrate;
- a semiconductor chip including a first surface, a second surface opposite to the first surface, at least one side surface extending between the first surface and the second surface, and at least one chip pad disposed adjacent to the first surface, wherein the chip pad is electrically connected to the substrate;
- and
- a heat dissipation structure covering the second surface and the side surface of the semiconductor chip and a portion of the substrate, wherein an area of the heat dissipation structure is greater than an area of the semiconductor chip.
A semiconductor package, comprising:
- a substrate;
- a semiconductor chip including a first surface, a second surface opposite to the first surface, and at least one chip pad disposed adjacent to the first surface, wherein the chip pad is electrically connected to the substrate;
- and
- a heat dissipation structure disposed between the second surface of the semiconductor chip and the substrate, wherein an area of the heat dissipation structure is greater than an area of the semiconductor chip.
Dependencies are inferred from the claim text.