Semiconductor device packages and method for manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsYu-Lin Shih, Chih-Cheng Lee
Life of this patent
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Abstract
A semiconductor device package includes a carrier, a patterned passivation layer and a first patterned conductive layer. The patterned passivation layer is disposed on the carrier. The first patterned conductive layer is disposed on the carrier and surrounded by the patterned passivation layer. The first patterned conductive layer has a first portion and a second portion electrically disconnected from the first portion. The first portion has a first surface adjacent to the carrier and exposed by the patterned passivation layer. The second portion has a first surface adjacent to the carrier exposed by the patterned passivation layer. The first surface of the first portion is in direct contact with an insulation medium.
Claims45
A semiconductor device package, comprising:
- a carrier;
- a patterned passivation layer disposed on the carrier;
- and
- a first patterned conductive layer disposed on the carrier and surrounded by the patterned passivation layer, the first patterned conductive layer having a first portion and a second portion electrically disconnected from the first portion, the first portion having a first surface adjacent to the carrier and exposed by the patterned passivation layer, and the second portion having a first surface adjacent to the carrier exposed by the patterned passivation layer;
- wherein the first surface of the first portion is in direct contact with an insulation medium, wherein the insulation medium comprises an insulation layer, and wherein the insulation layer comprises a pattern of grid.
A semiconductor device package, comprising:
- a carrier;
- a patterned passivation layer disposed on the carrier;
- and
- a first patterned conductive layer disposed on the carrier and surrounded by the patterned passivation layer, the first patterned conductive layer having a first portion and a second portion electrically disconnected from the first portion, the first portion having a first surface adjacent to the carrier and exposed by the patterned passivation layer, and the second portion having a first surface adjacent to the carrier exposed by the patterned passivation layer;
- wherein the first surface of the first portion is in direct contact with an insulation medium, and wherein the insulation medium comprises air.
A method of manufacturing a semiconductor device package, comprising:
- providing a carrier;
- forming a conductive layer on the carrier;
- forming a patterned passivation layer on the conductive layer;
- forming a first patterned conductive layer surrounded by the patterned passivation layer, the first patterned conductive layer having a first portion and a second portion electrically disconnected from the first portion, the first portion having a first surface adjacent to the carrier and exposed by the patterned passivation layer, and the second portion having a first surface adjacent to the carrier exposed by the patterned passivation layer;
- and
- making the first surface of the first portion in direct contact with an insulation medium, wherein making the first surface of the first portion in direct contact with the insulation medium further comprises changing characteristic of the conductive layer.
Dependencies are inferred from the claim text.