Semiconductor substrate including embedded component and method of manufacturing the same

A semiconductor substrate comprising:

• a first dielectric structure comprising a first surface and a second surface and a plurality of patterned conductive layers, wherein a topmost patterned conductive layer of the patterned conductive layers is embedded at the first surface of the first dielectric structure;
• a component embedded in the first dielectric structure and exposed from the second surface of the first dielectric structure;
• a second dielectric structure attached to the second surface of the first dielectric structure and covering the component;
• and
• a conductive via electrically connected to the component and to one of the patterned conductive layers,
• wherein the component comprises a thickness greater than a distance between the second surface of the first dielectric structure and one of the patterned conductive layers of the first dielectric structure.

A method of manufacturing a semiconductor substrate comprising:

• providing a multi-layered structure comprising a plurality of patterned conductive layers and a cavity;
• providing a first dielectric structure comprising a component disposed on a first surface of the first dielectric structure;
• aligning the component with the cavity of the multi-layered structure;
• laminating the multi-layered structure and the first dielectric structure to encapsulate the component;
• and
• electrically connecting the component to one of the patterned conductive layers.