Wiring structure, semiconductor package structure and semiconductor process
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsWen-Long LU, Ching Kuo HSU
Life of this patent
Estimating the term…
Abstract
A wiring structure includes a main body, a first dielectric layer, a first circuit layer and a second dielectric layer. The first dielectric layer is disposed on the main body, and defines a plurality of first grooves and at least one receiving portion between two first grooves. The first circuit layer is disposed on the first dielectric layer, and includes at least one first conductive trace disposed on the receiving portion. A width of the first conductive trace is less than a width of the receiving portion. A second dielectric layer disposed on the first dielectric layer, and extends into the first grooves.
Claims21
A wiring structure, comprising:
- a main body;
- a first dielectric layer disposed on the main body, and defining a plurality of first grooves and at least one receiving portion between two first grooves;
- a first circuit layer disposed on the first dielectric layer, and including at least one first conductive trace disposed on the receiving portion, a width of the first conductive trace being less than a width of the receiving portion;
- and
- a second dielectric layer disposed on the first dielectric layer, and extending into the first grooves.
A semiconductor package structure, comprising:
- a wiring structure, comprising:
- a main body;
- a first dielectric layer disposed on the main body, and defining a plurality of first grooves and at least one receiving portion between two first grooves;
- a first circuit layer disposed on the first dielectric layer, and including at least one first conductive trace disposed on the receiving portion, a width of the first conductive trace being less than a width of the receiving portion;
- and
- a second dielectric layer disposed on the first dielectric layer, and extending into the first grooves;
- and
- a semiconductor die disposed on and electrically connected to the wiring structure.
-20. (canceled)
A wiring structure, comprising:
- a main body;
- a first dielectric layer disposed on the main body, and defining a plurality of first grooves;
- a first circuit layer disposed on the first dielectric layer;
- and
- a second dielectric layer disposed on the first dielectric layer, the second dielectric layer comprising a plurality of extending portions that respectively extend into at least some of the first grooves of the plurality of first grooves.
Dependencies are inferred from the claim text.