Y10T 428/287
Including epoxy group or epoxy polymer
Official title: including epoxy group or epoxy polymer
Y10T428/287 (Including epoxy group or epoxy polymer) appears on 374 US grants and 327 published applications in this corpus.
Search patents in Y10T- Granted patents
- 374
- Published applications
- 327
- Assignees
- 206
- Inventors
- 917
- Latest grant
- 30 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 4 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 5 | 0 |
| 1982 | 1 | 0 |
| 1983 | 5 | 0 |
| 1984 | 1 | 0 |
| 1985 | 5 | 0 |
| 1986 | 3 | 0 |
| 1987 | 4 | 0 |
| 1988 | 0 | 0 |
| 1989 | 3 | 0 |
| 1990 | 5 | 0 |
| 1991 | 3 | 0 |
| 1992 | 5 | 0 |
| 1993 | 7 | 0 |
| 1994 | 5 | 0 |
| 1995 | 2 | 0 |
| 1996 | 2 | 0 |
| 1997 | 7 | 0 |
| 1998 | 7 | 0 |
| 1999 | 7 | 0 |
| 2000 | 10 | 0 |
| 2001 | 13 | 6 |
| 2002 | 11 | 15 |
| 2003 | 10 | 17 |
| 2004 | 26 | 18 |
| 2005 | 14 | 17 |
| 2006 | 8 | 16 |
| 2007 | 8 | 20 |
| 2008 | 7 | 18 |
| 2009 | 13 | 18 |
| 2010 | 18 | 20 |
| 2011 | 22 | 35 |
| 2012 | 9 | 30 |
| 2013 | 19 | 21 |
| 2014 | 21 | 18 |
| 2015 | 9 | 16 |
| 2016 | 12 | 3 |
| 2017 | 17 | 2 |
| 2018 | 7 | 6 |
| 2019 | 4 | 9 |
| 2020 | 5 | 3 |
| 2021 | 3 | 4 |
| 2022 | 7 | 6 |
| 2023 | 4 | 3 |
| 2024 | 6 | 5 |
| 2025 | 2 | 1 |
| 2026 | 3 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Pressure-sensitive adhesive tape suitable for component cutting process30 Jun 2026US 12,668,723 B2Nan Ya Plastics Corporation
- Adhesive for electrical storage device packaging material, electrical storage device packaging material, electrical storage device container, and electrical storage device5 May 2026US 12,617,987 B2artience Co., Ltd.
- Curable adhesive composition for die attach31 Mar 2026US 12,590,228 B2Henkel AG & Co. KGaA
- Thermosettable adhesive taped articles25 Nov 2025US 12,479,200 B23M Innovative Properties Company
- Gas barrier laminate11 Nov 2025US 12,466,170 B2Lintec Corporation
- Protective sheet for semiconductor processing, and method for manufacturing semiconductor device26 Jun 2025US 2025/0210403 A1Resonac Corporation
- Gas barrier laminate26 Dec 2024US 2024/0424777 A1Lintec Corporation
- Polyester pressure-sensitive adhesive composition, polyester pressure-sensitive adhesive, pressure-sensitive adhesive sheet, decorative film, film for electronic member, and decorative molded object19 Dec 2024US 2024/0417599 A1Mitsubishi Chemical Corporation
- Adhesive composition and film adhesive, and semiconductor package using film adhesive and producing method thereof22 Aug 2024US 2024/0279517 A1Furukawa Electric Co., Ltd.
- Pressure-sensitive adhesive tape suitable for component cutting process13 Jun 2024US 2024/0191105 A1Nan Ya Plastics Corporation
Most cited
By later US patents
- Activatable material115US 6,846,559 B2L&L Products, Inc. · 2005
- Structural reinforcement111US 6,941,719 B2L&L Products, Inc. · 2005
- Residuelessly redetachable contact-adhesive sheetlike structures103US 4,587,152 ABeiersdorf AG · 1986
- Method for electrically and mechanically connecting at least two conductive layers102US 5,502,889 ASheldahl, Inc. · 1996
- Area bonding conductive adhesive preforms89US 5,667,884 A1997