Pressure-sensitive adhesive tape suitable for component cutting process

A pressure-sensitive adhesive tape, including:

• a release film layer;
• an adhesive layer formed on a surface of the release film layer, wherein the adhesive layer includes 40-50 wt % of an acrylic resin, 40-65 wt % of an epoxy monomer, 0.05-0.5 wt % of a hardener, and 0.5-1.0 wt % of an initiator based on the adhesive layer having a total weight percent of 100 wt %;
• and wherein the acrylic resin has a chemical structure of the following formula (I),
• formula (I);
• wherein n=3,000 to 5,000;
• and
• a support base layer formed on a surface of the adhesive layer opposite to the release film layer;
• wherein the adhesive layer has a first acid value before being exposed to a ultraviolet light, the adhesive layer has a second acid value after being exposed to the ultraviolet light, and the second acid value is smaller than the first acid value:
• wherein the first acid value is between 5 mg KOH/g and 20 mg KOH/g, and the second acid value is between 1 mg KOH/g and 4 mg KOH/g;
• wherein a wavelength of the ultraviolet light is between 300 nm and 380 nm, an exposure energy of the ultraviolet light to the adhesive layer is between 100 mJ/cm2 and 300 mJ/cm2, and an exposure time of the ultraviolet light to the adhesive layer is between 0.05 minutes to 5.0 minutes.