Pressure-sensitive adhesive tape suitable for component cutting process

A pressure-sensitive adhesive tape suitable for component cutting process, including:

• a release film layer;
• an adhesive layer formed on one side of the release film layer, wherein the adhesive layer includes 40-50 wt % of an acrylic resin, 40-65 wt % of an epoxy monomer, 0.05-0.5 wt % of a hardener, and 0.5-1.0 wt % of an initiator based on the adhesive layer having a total weight percent of 100 wt %;
• and
• a support base layer formed on a side surface of the adhesive layer away from the release film layer;
• wherein the adhesive layer has a first acid value before being exposed to an ultraviolet light, the adhesive layer has a second acid value after being exposed to the ultraviolet light, and the second acid value is smaller than the first acid value.