Protective sheet for semiconductor processing, and method for manufacturing semiconductor device

A protective sheet for semiconductor processing, including:

• a substrate;
• and an intermediate layer and an adhesive layer in this order on one main surface of the substrate,
• the intermediate layer being a cured product of a resin composition containing an ethylenically unsaturated group-free (meth)acrylic resin (A1) and a crosslinking agent (B1), and
• the adhesive layer being a cured product of an adhesive composition containing an ethylenically unsaturated group-containing (meth)acrylic resin (A2), a crosslinking agent (B2), and a photopolymerization initiator (C),
• wherein the ethylenically unsaturated group-free (meth)acrylic resin (A1) has a plurality of functional groups that reacts with a functional group included in the crosslinking agent (B1),
• the ethylenically unsaturated group-containing (meth)acrylic resin (A2) has a plurality of functional groups that reacts with a functional group included in the crosslinking agent (B2), and
• the ethylenically unsaturated group-containing (meth)acrylic resin (A2) is an adduct of an epoxy group-containing ethylenically unsaturated compound (a2-3) to a copolymer of a monomer group (M2) that contains an alkyl (meth)acrylate (a2-1) and a carboxy group-containing ethylenically unsaturated compound (a2-2).