Y10T 29/49162
By using wire as conductive path
Official title: by using wire as conductive path
Y10T29/49162 (By using wire as conductive path) appears on 536 US grants and 386 published applications in this corpus.
Search patents in Y10T- Granted patents
- 536
- Published applications
- 386
- Assignees
- 270
- Inventors
- 893
- Latest grant
- 20 Feb 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 3 | 0 |
| 1978 | 4 | 0 |
| 1979 | 3 | 0 |
| 1980 | 1 | 0 |
| 1981 | 3 | 0 |
| 1982 | 2 | 0 |
| 1983 | 4 | 0 |
| 1984 | 5 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 15 | 0 |
| 1988 | 8 | 0 |
| 1989 | 10 | 0 |
| 1990 | 6 | 0 |
| 1991 | 8 | 0 |
| 1992 | 4 | 0 |
| 1993 | 8 | 0 |
| 1994 | 11 | 0 |
| 1995 | 14 | 0 |
| 1996 | 14 | 0 |
| 1997 | 17 | 0 |
| 1998 | 16 | 0 |
| 1999 | 9 | 0 |
| 2000 | 6 | 0 |
| 2001 | 14 | 7 |
| 2002 | 11 | 18 |
| 2003 | 17 | 22 |
| 2004 | 14 | 21 |
| 2005 | 19 | 29 |
| 2006 | 21 | 24 |
| 2007 | 27 | 22 |
| 2008 | 14 | 24 |
| 2009 | 15 | 30 |
| 2010 | 20 | 26 |
| 2011 | 23 | 18 |
| 2012 | 27 | 25 |
| 2013 | 21 | 19 |
| 2014 | 28 | 39 |
| 2015 | 20 | 36 |
| 2016 | 14 | 4 |
| 2017 | 23 | 3 |
| 2018 | 4 | 1 |
| 2019 | 3 | 5 |
| 2020 | 9 | 5 |
| 2021 | 2 | 5 |
| 2022 | 8 | 1 |
| 2023 | 2 | 2 |
| 2024 | 2 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Smart cards with metal layer(s) and methods of manufacture20 Feb 2024US 11,907,791 B2Amatech Group Lijited
- Stretchable conductors6 Feb 2024US 11,894,164 B23M Innovative Properties Compnay
- Smartcards with multiple coupling frames5 Dec 2023US 11,836,565 B2AmaTech Group Limited
- Method for use in making a blister package lid24 Oct 2023US 11,793,717 B1Automated Assembly Corporation
- Smart cards with metal layer(s) and methods of manufacture25 Oct 2022US 11,481,596 B2AmaTech Group Limited
- Smart cards with metal layer(s) and methods of manufacture4 May 2023US 2023/0137393 A1AmaTech Group Limited
- Smartcards with multiple coupling frames30 Mar 2023US 2023/0101906 A1AmaTech Group Limited
- Smartcards with multiple coupling frames5 May 2022US 2022/0138522 A1AmaTech Group Limited
- Stretchable conductors9 Sep 2021US 2021/0280337 A13M Innovative Properties Company
- Smart cards with metal layer(s) and methods of manufacture24 Jun 2021US 2021/0192312 A1AmaTech Group Limited
Most cited
By later US patents
- Three dimensional high performance interconnection package422US 5,371,654 AInternational Business Machines Corporation · 1994
- Flexible contact structure with an electrically conductive shell340US 5,917,707 AFormFactor, Inc. · 1999
- Packaged semiconductor die including heat sink with locking feature288US 5,701,034 AAmkor Electronics, Inc. · 1997
- Test probe for high density integrated circuits, methods of fabrication thereof and methods of use thereof284US 5,821,763 AInternational Business Machines Corporation · 1998
- Method of forming a three dimensional high performance interconnection package271US 5,531,022 AInternational Business Machines Corporation · 1996