Method for use in making a blister package lid

A method for use in making a lid for a blister package, comprising:

• forming a continuous pattern of electrically conductive wire on an adhesive surface of a substrate, the continuous pattern having a plurality of detector segments, and each detector segment having an outer connector portion and an inner connector portion;
• wherein the outer connector portion and the inner connector portion of each detector segment are adjacent to one another, and pairs of successive first and second detector segments of the plurality of detector segments are connected by the inner connector portion of the first detector segment and the outer connector portion of the second detector segment;
• and
• wherein the forming includes forming an arced segment between the inner connector portion of the first detector segment and the outer connector portion of the second detector segment.

A structure having detector wiring, comprising:

• a substrate;
• a layer of adhesive disposed on a first surface of the substrate;
• a continuous pattern of electrically conductive wire disposed directly on the layer of adhesive, the continuous pattern having a plurality of detector segments, and each detector segment having an outer connector portion and an inner connector portion;
• and
• wherein the outer connector portion and the inner connector portion of each detector segment are adjacent to one another, and pairs of successive first and second detector segments of the plurality of detector segments are connected between the inner connector portion of the first detector segment and the outer connector portion of the second detector segment.