Y10T 29/49142
Including metal fusion
Official title: including metal fusion
Y10T29/49142 (Including metal fusion) appears on 160 US grants and 83 published applications in this corpus.
Search patents in Y10T- Granted patents
- 160
- Published applications
- 83
- Assignees
- 104
- Inventors
- 262
- Latest grant
- 11 Apr 2017
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 3 | 0 |
| 1981 | 0 | 0 |
| 1982 | 2 | 0 |
| 1983 | 2 | 0 |
| 1984 | 3 | 0 |
| 1985 | 3 | 0 |
| 1986 | 4 | 0 |
| 1987 | 5 | 0 |
| 1988 | 1 | 0 |
| 1989 | 3 | 0 |
| 1990 | 3 | 0 |
| 1991 | 0 | 0 |
| 1992 | 3 | 0 |
| 1993 | 3 | 0 |
| 1994 | 2 | 0 |
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 6 | 0 |
| 1998 | 6 | 0 |
| 1999 | 5 | 0 |
| 2000 | 10 | 0 |
| 2001 | 4 | 3 |
| 2002 | 4 | 7 |
| 2003 | 7 | 7 |
| 2004 | 5 | 7 |
| 2005 | 7 | 3 |
| 2006 | 9 | 10 |
| 2007 | 6 | 6 |
| 2008 | 2 | 6 |
| 2009 | 5 | 9 |
| 2010 | 10 | 8 |
| 2011 | 4 | 3 |
| 2012 | 10 | 5 |
| 2013 | 2 | 3 |
| 2014 | 4 | 4 |
| 2015 | 1 | 2 |
| 2016 | 6 | 0 |
| 2017 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Method of assembling a heat dissipating module of an electronic device11 Apr 2017US 9,622,385 B2Delta Electronics, Inc.
- Substrate structure having electronic components and method of manufacturing substrate structure having electronic components1 Nov 2016US 9,485,878 B2Samsung Electro-Mechanics Co., Ltd.
- Printed wiring board and a method of manufacturing a printed wiring board25 Oct 2016US 9,480,170 B2Ibiden Co., Ltd.
- Testing probe head for wafer level testing, and test probe card16 Aug 2016US 9,417,263 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Illumination device comprising two printed circuit boards7 Jun 2016US 9,362,650 B2OSRAM GmbH
- Heat dissipating module and assembling method thereof25 Jun 2015US 2015/0181765 A1Delta Electronics, Inc.
- Heat Resistant Magnetic Electrical Connector2 Apr 2015US 2015/0093920 A1Genesis Technology USA, Inc.
- Test probe card27 Nov 2014US 2014/0347085 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Electronic circuit, light source device, and method of manufacturing electronic circuit17 Jul 2014US 2014/0198469 A1Ricoh Company, Ltd.
- Substrate structure having electronic components and method of manufacturing substrate structure having electronic components24 Apr 2014US 2014/0111958 A1Samsung Electro-Mechanics Co., Ltd.
Most cited
By later US patents
- Capacitive pressure sensor for a pressure transmitted where electric field emanates substantially from back sides of plates131US 5,637,802 ARosemount Inc. · 1997
- Surface mount compatible connector system with mechanical integrity98US 4,641,426 AAssociated Enterprises, Inc. · 1987
- Hybrid integrated circuit component and printed circuit board mounting said component90US 4,495,546 AMatsushita Electric Industrial Co., Ltd. · 1985
- Surface mount compatible connector system with solder strip and mounting connector to PCB75US 4,884,335 AMinnesota Mining and Manufacturing Company · 1989
- Process for making an electrical interconnect structure73US 5,802,711 AInternational Business Machines Corporation · 1998