Test probe card
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYung-Hsin KUO, Wensen HUNG, Po-Shi YAO
Life of this patent
Estimating the term…
Abstract
A testing probe card for wafer level testing semiconductor IC packaged devices. The card includes a circuit board including testing circuitry and a testing probe head. The probe head includes a probe array having a plurality of metallic testing probes attached to a substrate including a plurality of conductive vias. In one embodiment, the probes have a relatively rigid construction and have one end that may be electrically coupled to the vias using a flip chip assembly solder reflow process. In one embodiment, the probes may be formed from a monolithic block of conductive material using reverse wire electric discharge machining.
Claims20
A testing probe head for wafer level testing comprising:
- a support substrate including a plurality of vias;
- and
- a probe array comprising a plurality of testing probes attached to and cantilevered from the support substrate, each of the plurality of testing probes electrically coupled to a respective via and arranged to engage a corresponding testing contact in a device under test in a semiconductor IC package;
- wherein the plurality of testing probes are operable to receive and transmit electrical signal between a printed circuit board in a test probe card and device the under test for conducting wafer level testing.
The testing probe head of claim 9, wherein the plurality of testing probes have a maximum traverse width of about 20 microns.
A testing probe head for wafer level testing comprising:
- a support substrate comprising silicon and including a plurality of through silicon vias (TSV);
- and
- a probe array comprising a plurality of rigid metallic testing probes attached to and cantilevered from the support substrate, each of the plurality of testing probes electrically coupled to a respective via and arranged to engage a corresponding testing contact in a device under test in a semiconductor IC package,
- wherein the plurality of testing probes are operable to receive and transmit electrical signal between a printed circuit board in a test probe card and device the under test for conducting wafer level testing.
A test probe card for wafer level testing comprising:
- a mounting assembly;
- a printed circuit board including testing circuitry and supported from the mounting assembly;
- and
- a testing probe head for wafer level testing comprising:
- a support substrate including a plurality of vias;
- and
- a probe array comprising a plurality of testing probes attached to and cantilevered from the support substrate, each of the plurality of testing probes electrically coupled to a respective via and arranged to engage a corresponding testing contact in a device under test in a semiconductor IC package;
- wherein the plurality of testing probes are operable to receive and transmit electrical signal between a printed circuit board in a test probe card and device the under test for conducting wafer level testing.
Dependencies are inferred from the claim text.