Substrate structure having electronic components and method of manufacturing substrate structure having electronic components

A method of manufacturing a substrate structure having electronic components, comprising:

• providing a substrate having one surface, the other surface opposite to the one surface, and a cavity formed by penetrating between the one surface and the other surface;
• attaching a detach film to the one surface of the substrate;
• fixing a first electronic component by filling a filler in a space between the cavity and the first electronic component after inserting the first electronic component having a first terminal on a surface in the cavity to attach the first electronic component to the detach film;
• removing the detach film after fixing the first electronic component;
• forming a first circuit pattern and a second circuit pattern on the one surface of the substrate from which the detach film is removed;
• forming a plated terminal on a surface of the first terminal from which the detach film is removed;
• and
• mounting a second electronic component so that a second terminal of the second component having at least one second terminal on at least one surface is electrically connected to the plated terminal.

A substrate structure having electronic components, comprising:

• a substrate having one surface, the other surface opposite to the one surface, and a cavity formed by penetrating between the one surface and the other surface;
• a first circuit pattern and a second circuit pattern provided on the one surface of the substrate;
• a first electronic component of which a portion is inserted in the cavity and the remaining portion protrudes outside the cavity and having a first terminal formed on a surface;
• a filler for filling a space between the cavity and the first electronic component;
• a first surface treatment layer provided on an upper surface of the first terminal of the first electronic component;
• and
• a second electronic component mounted on the one surface of the substrate and having a second terminal electrically connected to the first surface treatment layer.

A method of manufacturing a substrate structure having electronic components, comprising:

• providing a substrate having one surface, the other surface opposite to the one surface, a seed layer made of a conductive material on the one surface, and a cavity formed by penetrating between an upper surface of the seed layer and the other surface;
• attaching a detach film to the upper surface of the seed layer;
• fixing a first electronic component by filling a filler in a space between the cavity and the first electronic component after inserting the first electronic component having a first terminal on a surface in the cavity to attach the first electronic component to the detach film;
• removing the detach film after fixing the first electronic component;
• forming a first circuit pattern and a second circuit pattern by patterning the seed layer from which the detach film is removed;
• forming a first surface treatment layer on a surface of the first terminal from which the detach film is removed;
• and
• mounting a second electronic component so that a second terminal of the second component having at least one second terminal on at least one surface is electrically connected to the first surface treatment layer.