Y10T 29/49121
Beam lead frame or beam lead device
Y10T29/49121 (Beam lead frame or beam lead device) appears on 1,794 US grants and 748 published applications in this corpus.
Search patents in Y10T- Granted patents
- 1,794
- Published applications
- 748
- Assignees
- 521
- Inventors
- 2,375
- Latest grant
- 13 Feb 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 21 | 0 |
| 1977 | 18 | 0 |
| 1978 | 16 | 0 |
| 1979 | 13 | 0 |
| 1980 | 14 | 0 |
| 1981 | 12 | 0 |
| 1982 | 7 | 0 |
| 1983 | 12 | 0 |
| 1984 | 15 | 0 |
| 1985 | 13 | 0 |
| 1986 | 18 | 0 |
| 1987 | 29 | 0 |
| 1988 | 33 | 0 |
| 1989 | 57 | 0 |
| 1990 | 33 | 0 |
| 1991 | 70 | 0 |
| 1992 | 61 | 0 |
| 1993 | 77 | 0 |
| 1994 | 96 | 0 |
| 1995 | 102 | 0 |
| 1996 | 87 | 0 |
| 1997 | 72 | 0 |
| 1998 | 52 | 0 |
| 1999 | 42 | 0 |
| 2000 | 38 | 0 |
| 2001 | 49 | 35 |
| 2002 | 64 | 59 |
| 2003 | 64 | 73 |
| 2004 | 57 | 71 |
| 2005 | 38 | 54 |
| 2006 | 64 | 47 |
| 2007 | 51 | 48 |
| 2008 | 46 | 76 |
| 2009 | 32 | 52 |
| 2010 | 47 | 38 |
| 2011 | 45 | 37 |
| 2012 | 46 | 23 |
| 2013 | 31 | 19 |
| 2014 | 32 | 30 |
| 2015 | 24 | 23 |
| 2016 | 21 | 16 |
| 2017 | 17 | 16 |
| 2018 | 21 | 14 |
| 2019 | 14 | 9 |
| 2020 | 13 | 4 |
| 2021 | 8 | 2 |
| 2022 | 1 | 1 |
| 2023 | 0 | 1 |
| 2024 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Method of manufacturing an ultrasonic probe13 Feb 2024US 11,903,319 B2FUJIFILM Healthcare Corporation
- Ultrasonic probe27 Dec 2022US 11,538,982 B2FUJIFILM Healthcare Corporation
- Planar cavity MEMS and related structures, methods of manufacture and design structures16 Nov 2021US 11,174,160 B2International Business Machines Corporation
- Planar cavity mems and related structures, methods of manufacture and design structures7 Sep 2021US 11,111,138 B2International Business Machines Corporation
- Planar cavity MEMS and related structures, methods of manufacture and design structures7 Sep 2021US 11,111,139 B2International Business Machines Corporation
- Electronic module13 Jul 2023US 2023/0225055 A1Imberatek, LLC
- Ultrasonic probe and method of manufacturing backing25 Aug 2022US 2022/0271216 A1FUJIFILM Healthcare Corporation
- Electronic module14 Oct 2021US 2021/0321520 A1Imberatek, LLC
- Electronic module4 Feb 2021US 2021/0037654 A1Imberatek, LLC
- Ultrasonic Probe and Method of Manufacturing Backing27 Feb 2020US 2020/0060650 A1Hitachi, Ltd.
Most cited
By later US patents
- Method for making semiconductor device having no die supporting surface430US 5,474,958 AMotorola, Inc. · 1995
- Arrays of optoelectronic devices and method of making same426US 5,660,461 AQuantum Devices, Inc. · 1997
- Integrated structures and fabrication methods thereof implementing a cell phone or other electronic system387US 7,619,901 B2EPIC Technologies, Inc. · 2009
- Plastic integrated circuit device package and leadframe having partially undercut leads and die pad364US 6,281,568 B1Amkor Technology, Inc. · 2001
- Plastic integrated circuit package and method and leadframe for making the package363US 6,143,981 AAmkor Technology, Inc. · 2000