Method of manufacturing an ultrasonic probe
AssigneeFUJIFILM Healthcare Corporation
InventorsHidetsugu Katsura, Yoshihiro Tahara, Kazuhiro Kobayashi
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Abstract
The present invention is directed to improving an insulating property of a backing in which a lead array is buried. The method includes a coating forming process, in which insulating coatings are formed with respect to at least a plurality of lead rows included in a plurality of lead frames; after the forming of the insulating coatings, a plate manufacturing process, in which a plurality of backing plates are manufactured by pouring a backing material towards a lead row in each of the plurality of lead frames so that the lead row and the backing material are integrated with each other; and a laminating process, in which the plurality of backing plates are laminated.
Claims3
A method of manufacturing a backing, comprising:
- a coating forming process, in which insulating coatings are formed with respect to at least a plurality of lead rows included in a plurality of lead frames;
- after the forming of the insulating coatings, a plate manufacturing process, in which a plurality of backing plates are manufactured by pouring a backing material towards a lead row in each of the plurality of lead frames so that the lead row and the backing material are integrated with each other;
- and
- a laminating process, in which the plurality of backing plates are laminated;
- wherein
- in the plate manufacturing process, for each lead frame, a masking sheet is provided on one side of the lead frame, and a mold is provided on the other side of the lead frame, and the backing material is poured into a space surrounded by the masking sheet and the mold.
Dependencies are inferred from the claim text.