Y10T 225/304
Including means to apply thermal shock to work
Y10T225/304 (Including means to apply thermal shock to work) appears on 113 US grants and 49 published applications in this corpus.
Search patents in Y10T- Granted patents
- 113
- Published applications
- 49
- Assignees
- 68
- Inventors
- 215
- Latest grant
- 1 Nov 2022
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 6 | 0 |
| 1977 | 3 | 0 |
| 1978 | 3 | 0 |
| 1979 | 0 | 0 |
| 1980 | 3 | 0 |
| 1981 | 4 | 0 |
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 4 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 3 | 0 |
| 1988 | 5 | 0 |
| 1989 | 0 | 0 |
| 1990 | 2 | 0 |
| 1991 | 0 | 0 |
| 1992 | 7 | 0 |
| 1993 | 5 | 0 |
| 1994 | 3 | 0 |
| 1995 | 3 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 5 | 0 |
| 1999 | 4 | 0 |
| 2000 | 4 | 0 |
| 2001 | 2 | 1 |
| 2002 | 1 | 3 |
| 2003 | 3 | 5 |
| 2004 | 4 | 5 |
| 2005 | 4 | 3 |
| 2006 | 3 | 6 |
| 2007 | 0 | 3 |
| 2008 | 1 | 2 |
| 2009 | 2 | 1 |
| 2010 | 4 | 1 |
| 2011 | 2 | 1 |
| 2012 | 2 | 1 |
| 2013 | 0 | 2 |
| 2014 | 1 | 2 |
| 2015 | 2 | 5 |
| 2016 | 1 | 1 |
| 2017 | 2 | 3 |
| 2018 | 1 | 1 |
| 2019 | 1 | 1 |
| 2020 | 4 | 1 |
| 2021 | 1 | 1 |
| 2022 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Glass bottle cutter based on electric heating1 Nov 2022US 11,485,672 B2
- Combined wafer production method with a receiving layer having holes30 Mar 2021US 10,960,574 B2Siltectra GmbH
- Method for cutting plate-like glass, and cutting device therefor10 Nov 2020US 10,829,404 B2Nippon Electric Glass Co., Ltd.
- Method of separating a back layer on a singulated semiconductor wafer attached to carrier substrate8 Sep 2020US 10,770,350 B2Semiconductor Components Industries, LLC
- Method of cutting brittle material, device for cutting brittle material, method of manufacturing cut brittle material and cut brittle material3 Mar 2020US 10,576,651 B2Central Glass Company, Limited
- Glass Bottle Cutter Based on Electric Heating28 Oct 2021US 2021/0331962 A1
- Method of singulating semiconductor wafer having a plurality of die and a back layer disposed along a major surface16 Apr 2020US 2020/0118878 A1Semiconductor Components Industries, LLC
- Method of singulating semiconductor wafer having a plurality of die and a back layer disposed along a major surface11 Jul 2019US 2019/0214301 A1Semiconductor Components Industries, LLC
- Method of singulating semiconductor wafer having a plurality of die and a back layer disposed along a major surface20 Sep 2018US 2018/0269104 A1Semiconductor Components Industries, LLC
- Method of Cutting Brittle Material, Device for Cutting Brittle Material, Method of Manufacturing Cut Brittle Material and Cut Brittle Material21 Dec 2017US 2017/0361486 A1Central Glass Company, Limited
Most cited
By later US patents
- Method and apparatus for separating non-metallic substrates utilizing a laser initiated scribe157US 6,211,488 B1Accudyne Display and Semiconductor Systems, Inc. · 2001
- Method of splitting non-metallic materials155US 5,609,284 AFonon Technology Limited · 1997
- Method and apparatus for breaking brittle materials126US 5,826,772 ACorning Incorporated · 1998
- Laser cleavage cutting method and system121US 5,968,382 AHitachi, Ltd. · 1999
- Method and apparatus for separating non-metallic materials89US 6,489,588 B1Applied Photonics, Inc. · 2002