Combined wafer production method with a receiving layer having holes

A method for producing solid layers, comprising:

• providing a solid for separating at least one solid layer;
• fixing an accommodating layer for holding the solid layer on the solid, wherein the accommodating layer has a multiplicity of holes for conducting a liquid, wherein the accommodating layer is fixed on the solid by means of a connecting layer;
• thermal loading of the accommodating layer for mechanical generation of stresses in the solid, wherein a crack in the solid propagates along a detachment plane due to the stresses, wherein the solid layer is separated from the solid by means of the crack, wherein the accommodating layer comprises at least one polymer material, wherein the polymer material undergoes a glass transition at a temperature lower than 0° C.;
• and
• after the thermal loading, guiding a fluid through the holes in the accommodating layer and onto the connecting layer, wherein the fluid weakens, decomposes or dissolves the connecting layer such that the fixing of the accommodating layer on the solid is weakened or terminated,
• wherein the accommodating layer comprises a first material portion and a second material portion different than the first material portion,
• wherein the first material portion has the holes,
• wherein the holes are lined by the second material portion.