Y10S 83/942
Contact pin of electrical component
Y10S83/942 (Contact pin of electrical component) appears on 38 US grants and 10 published applications in this corpus.
Search patents in Y10S- Granted patents
- 38
- Published applications
- 10
- Assignees
- 18
- Inventors
- 45
- Latest grant
- 16 Apr 2019
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 2 | 0 |
| 1980 | 2 | 0 |
| 1981 | 2 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 3 | 0 |
| 1985 | 2 | 0 |
| 1986 | 3 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 2 | 0 |
| 1995 | 0 | 0 |
| 1996 | 2 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 1 |
| 2002 | 2 | 3 |
| 2003 | 4 | 2 |
| 2004 | 0 | 0 |
| 2005 | 2 | 0 |
| 2006 | 1 | 4 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 1 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Lead trimming module16 Apr 2019US 10,264,720 B1Flextronics AP, LLC
- Methods for securing packaged semiconductor devices to carrier substrates4 Aug 2009US 7,569,418 B2Micron Technology, Inc.
- Methods for modifying a vertical surface mount package1 Aug 2006US 7,082,681 B2Micron Technology, Inc.
- Vertically mountable and alignable semiconductor device assembly8 Nov 2005US 6,963,128 B2Micron Technology, Inc.
- Cutter blade position detection mechanism and method of reporting cutter malfunction10 May 2005US 6,889,585 B1International Business Machines Corporation
- Vertically mountable and alignable semiconductor device packages and assemblies including the same16 Feb 2006US 2006/0033190 A1
- Methods for securing packaged semiconductor devices to carrier substrates9 Feb 2006US 2006/0030072 A1Micron Technology, Inc.
- Alignment devices for securing semiconductor devices to carrier substrates, and assemblies including the alignment devices5 Jan 2006US 2006/0001150 A1
- Semiconductor device packages including leads with substantially planar exposed portions extending from bottom edges of the packages, and assemblies including the packages5 Jan 2006US 2006/0001155 A1
- Methods for modifying a vertical surface mount package23 Oct 2003US 2003/0196323 A1Micron Technology, Inc.
Most cited
By later US patents
- Method of forming radiating coaxial cable323US 5,543,000 ATrilogy Communications, Inc. · 1996
- Radiating coaxial cable117US 5,339,058 ATrilogy Communications, Inc. · 1994
- Cutter blade position detection mechanism and method of reporting cutter malfunction72US 6,889,585 B1International Business Machines Corporation · 2005
- Method of manufacturing a known good die array36US 5,548,884 ASamsung Electronics Co., Ltd. · 1996
- Method for cutting lead wires32US 4,436,006 AMatsushita Electric Industrial Co., Ltd. · 1984