Methods for securing packaged semiconductor devices to carrier substrates
AssigneeMicron Technology, Inc.
InventorsLarry Kinsman, Walter Moden, Warren Farnworth
Life of this patent
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Abstract
A method for securing a semiconductor device to a carrier substrate includes inserting a semiconductor device with a plurality of stub contacts extending from a bottom edge thereof into a receptacle of an alignment device associated with the carrier substrate. Upon attachment of the alignment device to a carrier substrate and insertion of a vertically mountable semiconductor device into the receptacle, the semiconductor device is biased so as to establish and maintain electrical communication between the semiconductor device and the carrier substrate.
Claims30
A method for securing a semiconductor device to a carrier substrate, comprising:
- inserting a semiconductor device including a bottom edge and a plurality of stub contacts extending therefrom into at least one receptacle of an alignment device associated with the carrier substrate such that the semiconductor device is oriented nonparallel to the carrier substrate;
- and
- biasing the semiconductor device toward the carrier substrate.
A method for securing a semiconductor device to a carrier substrate, comprising:
- inserting a semiconductor device including a plurality of stub contacts protruding from a single edge thereof into at least one receptacle of an alignment device;
- and
- biasing the semiconductor device toward an end of the at least one receptacle so as to establish electrical communication between at least some of the stub contacts and corresponding conductive features of the carrier substrate.
Dependencies are inferred from the claim text.