Vertically mountable and alignable semiconductor device assembly
AssigneeMicron Technology, Inc.
InventorsLarry D. Kinsman, Walter L. Moden, Warren M. Farnworth
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Abstract
A vertically mountable semiconductor device including a plurality of stub contacts extending perpendicularly from a bottom edge thereof. A complementary alignment device includes a receptacle for receiving the vertically mountable semiconductor device. The alignment device is attachable to a carrier substrate. Upon attachment of the alignment device to a carrier substrate and insertion of a vertically mountable semiconductor device into the receptacle, a contact element applies a downward force to the vertically mountable semiconductor device to establish and maintain an electrical connection between the vertically mountable semiconductor device and the carrier substrate.
Claims8
A semiconductor device assembly, comprising:
- at least one semiconductor device package including:
- an integrated circuit die;
- and
- a plurality of leads, each of the plurality of leads consisting essentially of a substantially planar external portion extending outward from a bottom edge of the at least one semiconductor device package, at least a portion of the plurality of leads in communication with the integrated circuit die;
- and
- an alignment device having a receptacle formed therein, the receptacle configured to removably receive the at least one semiconductor device package in a nonparallel orientation relative to a substrate.
Dependencies are inferred from the claim text.