Alignment devices for securing semiconductor devices to carrier substrates, and assemblies including the alignment devices
OwnerLarry Kinsman, Walter Moden +1inventors
InventorsLarry Kinsman, Walter Moden, Warren Farnworth
Life of this patent
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Abstract
A semiconductor device including a plurality of stub contacts extending from a single edge thereof. A complementary alignment device includes at least one receptacle for receiving the semiconductor device. The alignment device is securable to a carrier substrate. A contact element may be configured to bias the semiconductor device in such a way as to establish and maintain electrical communication between the semiconductor device and the carrier substrate.
Claims41
A semiconductor device assembly, comprising:
- at least one semiconductor device including a plurality of stub contacts extending from a bottom edge thereof;
- an alignment device including at least one receptacle configured to removably receive the at least one semiconductor device in nonparallel orientation relative to a carrier substrate and to align at least some of the plurality of stub contacts thereof with corresponding terminals of the carrier substrate;
- and
- at least one contact element configured to bias the at least one semiconductor device toward the carrier substrate.
A semiconductor device assembly, comprising:
- at least one semiconductor device including a plurality of stub contacts extending from a single edge thereof;
- an alignment device including at least one receptacle configured to removably receive the at least one semiconductor device;
- and
- at least one biasing element configured to bias the at least one semiconductor device in such a way as to establish electrical communication between at least some of the stub contacts and corresponding conductive features of a carrier substrate.
An alignment device for securing a semiconductor device relative to a carrier substrate, the alignment device comprising:
- a body;
- at least one receptacle in the body and configured to receive at least one semiconductor device;
- and
- at least one biasing element configured to bias at least some stub contacts of a semiconductor device within the at least one receptacle into electrical communication with corresponding electrical features of the carrier substrate.
A computer comprising:
- a carrier substrate;
- an alignment device including at least one receptacle configured to removably receive at least one semiconductor device in nonparallel orientation to the carrier substrate and a contact element at least partially disposable over the at least one receptacle, the alignment device being secured to the carrier substrate;
- and
- a semiconductor device insertable within the receptacle, the contact element being configured to bias the semiconductor device into electrical communication with the carrier substrate.
Dependencies are inferred from the claim text.