Method for cutting lead wires
AssigneesMatsushita Electric Industrial Co., Ltd., Mitsubishi Metal Corporation
InventorsHiromichi Nakamura, Haruya Urano, Tatsuo Kojima, Mitsunao Sekiwa
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Abstract
A cutting method comprising using a main body in the form of a circular disk and a hard layer provided on one surface of the main body and having a thickness of 0.02 to 0.2 mm. The hard layer is made of cemented carbides, TiC TaC, Cr.sub.2 C.sub.3, Al.sub.2 O.sub.3 or the like, while the main body is made of a material, such as steel, non-ferrous metal or plastics, which is lower than the hard layer in abrasion resistance. The hard layer is formed along its outer periphery with a cutting edge which is self-sharpened when chipped.
Claims6
In a method of cutting lead wires projecting from one side of print base panels by relatively moving the panels and a rotating circular cutting disk having a peripheral cutting edge adapted to sever the lead wires, the improvement comprising the steps of
- providing the cutting disk with a main body and an annular hard layer of from 0.02 to 0.2 mm in thickness made from at least one material selected from the group consisting of cemented carbide, TiC, TaC, Cr.sub.2 C.sub.3 and Al.sub.2 O.sub.3, said hard layer forming said peripheral cutting edge and extending radially inwardly thereof, said main body having lower abrasion resistance than said hard layer;
- and
- severing the lead wires successively from a plurality of panels by rotating the cutting disk at a speed sufficiently high to cause the peripheral cutting edge to be self-sharpening by chipping of said hard layer from successive contacts with the lead wires.
Dependencies are inferred from the claim text.