Semiconductor device packages including leads with substantially planar exposed portions extending from bottom edges of the packages, and assemblies including the packages
OwnerLarry Kinsman, Walter Moden +1inventors
InventorsLarry Kinsman, Walter Moden, Warren Farnworth
Life of this patent
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Abstract
A semiconductor device package including leads with substantially planar exposed portions extending from a bottom edge of the package. The exposed portions of the leads may comprise stub contacts extending perpendicularly from the bottom edge. The exposed portions of the leads may be substantially rigid or nondeformable. A complementary alignment device that may be used with the semiconductor device package may include a receptacle for receiving the semiconductor device package.
Claims21
A packaged semiconductor device, comprising:
- a semiconductor die;
- a package encapsulating at least a portion of the semiconductor die;
- and
- a plurality of leads, each lead of the plurality of leads including an external portion that consists essentially of a substantially planar element extending outward from a bottom edge of the package, at least a portion of each lead in communication with a bond pad of the semiconductor die.
A packaged semiconductor device, comprising:
- a semiconductor die;
- a package covering at least a portion of the semiconductor die;
- a plurality of leads in communication with corresponding bond pads of the semiconductor die, each lead of the plurality including an external portion consisting essentially of a substantially planar element extending outwardly from a single, bottom edge of the package in a plane substantially parallel to a plane of the semiconductor die.
A semiconductor device assembly, comprising:
- at least one semiconductor device package including:
- a semiconductor die;
- a package covering at least a portion of the semiconductor die;
- and
- a plurality of leads in communication with corresponding bond pads of the semiconductor die, each lead of the plurality including an external portion consisting essentially
- of a substantially planar element protruding from a single, bottom edge of the package;
- and
- an alignment device including a receptacle configured to removably receive the at least one semiconductor device package in a nonparallel orientation relative to a substrate.
Dependencies are inferred from the claim text.