Y10S 414/137
Including means for charging or discharging wafer cassette
Official title: including means for charging or discharging wafer cassette
Y10S414/137 (Including means for charging or discharging wafer cassette) appears on 929 US grants and 299 published applications in this corpus.
Search patents in Y10S- Granted patents
- 929
- Published applications
- 299
- Assignees
- 282
- Inventors
- 1,389
- Latest grant
- 21 May 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 4 | 0 |
| 1978 | 3 | 0 |
| 1979 | 2 | 0 |
| 1980 | 2 | 0 |
| 1981 | 4 | 0 |
| 1982 | 3 | 0 |
| 1983 | 6 | 0 |
| 1984 | 10 | 0 |
| 1985 | 14 | 0 |
| 1986 | 14 | 0 |
| 1987 | 19 | 0 |
| 1988 | 23 | 0 |
| 1989 | 20 | 0 |
| 1990 | 22 | 0 |
| 1991 | 17 | 0 |
| 1992 | 11 | 0 |
| 1993 | 27 | 0 |
| 1994 | 21 | 0 |
| 1995 | 37 | 0 |
| 1996 | 26 | 0 |
| 1997 | 45 | 0 |
| 1998 | 53 | 0 |
| 1999 | 53 | 0 |
| 2000 | 80 | 0 |
| 2001 | 67 | 41 |
| 2002 | 72 | 52 |
| 2003 | 47 | 33 |
| 2004 | 41 | 36 |
| 2005 | 25 | 21 |
| 2006 | 25 | 12 |
| 2007 | 12 | 18 |
| 2008 | 13 | 13 |
| 2009 | 10 | 16 |
| 2010 | 17 | 13 |
| 2011 | 15 | 8 |
| 2012 | 9 | 9 |
| 2013 | 3 | 7 |
| 2014 | 13 | 2 |
| 2015 | 14 | 7 |
| 2016 | 4 | 2 |
| 2017 | 6 | 0 |
| 2018 | 4 | 2 |
| 2019 | 1 | 2 |
| 2020 | 4 | 2 |
| 2021 | 2 | 1 |
| 2022 | 1 | 1 |
| 2023 | 3 | 1 |
| 2024 | 2 | 0 |
By publication year. Applications have been published since 2001.
Subgroups
Granted patents
Recent patents
- Sealed substrate carriers and systems and methods for transporting substrates21 May 2024US 11,990,358 B2APPLIED Materials.Inc.
- Systems and methods for wafer pod alignment7 May 2024US 11,978,653 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Substrate transfer device and method of operating the same12 Dec 2023US 11,839,968 B2Kawasaki Jukogyo Kabushiki Kaisha
- Wafer transfer apparatus and substrate transfer apparatus26 Sep 2023US RE49,671 E1Kawasaki Jukogyo Kabushiki Kaisha
- Sealed substrate carriers and systems and methods for transporting substrates18 Apr 2023US 11,631,605 B2APPLIED Materials.Inc.
- Sealed substrate carriers and systems and methods for transporting substrates10 Aug 2023US 2023/0253228 A1APPLIED Materials.Inc.
- Systems and methods for wafer pod alignment1 Dec 2022US 2022/0384232 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Substrate transfer device and method of operating the same19 Aug 2021US 2021/0252716 A1Kawasaki Jukogyo Kabushiki Kaisha
- Systems and methods for wafer pod alignment26 Nov 2020US 2020/0373181 A1Taiwan Semiconductor Manafacturing Co., Ltd.
- Sealed substrate carriers and systems and methods for transporting substrates23 Apr 2020US 2020/0126832 A1APPLIED Materials.Inc.
Most cited
By later US patents
- Multi-chamber integrated process system988US 4,951,601 AAPPLIED Materials.Inc. · 1990
- Modular wafer transport and processing system655US 4,917,556 AVarian Associates, Inc. · 1990
- Modular architecture for semiconductor wafer fabrication equipment638US 6,312,525 B1APPLIED Materials.Inc. · 2001
- Modular processing apparatus for processing semiconductor wafers635US 4,722,298 AMachine Technology, Inc. · 1988
- Wafer handling apparatus and method583US 4,789,294 ACanon Kabushiki Kaisha · 1988