Sealed substrate carriers and systems and methods for transporting substrates

A first system component of a semiconductor processing system, the first system component comprising:

• a body forming a first chamber, wherein:
• a first sealed environment in the first chamber is at a first state prior to a door being opened;
• a load port structure is disposed between the first system component and a second system component;
• the load port structure comprises a plurality of walls disposed around an opening of the load port structure;
• the load port structure is separate from the first system component and the second system component;
• and
• a third system component is configured to change at least one of the first state of the first sealed environment within the first chamber or a second state of a second sealed environment within a second chamber formed by the second system component to cause the first state and the second state to be substantially similar before the door between the first sealed environment and the second sealed environment is opened.