Y10S 148/075
Imide resists
Y10S148/075 (Imide resists) appears on 8 US grants and 0 published applications in this corpus.
Search patents in Y10S- Granted patents
- 8
- Published applications
- 0
- Assignees
- 6
- Inventors
- 18
- Latest grant
- 16 Dec 2003
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 1 | 0 |
| 1986 | 3 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Method of manufacturing a semiconductor component and polyimide etchant therefor16 Dec 2003US 6,664,200 B1
- Polyimide process for protecting integrated circuits7 Sep 1993US 5,242,864 AIntel Corporation
- High temperature lift-off process9 Apr 1991US 5,006,488 AInternational Business Machines Corporation
- Self-aligned dielectric assisted planarization process26 Feb 1991US 4,996,165 ARockwell International Corporation
- Method of manufacturing a solid-state image pickup device2 Sep 1986US 4,608,749 AKabushiki Kaisha Toshiba
No published applications in this class yet.
Most cited
By later US patents
- Self-aligned dielectric assisted planarization process134US 4,996,165 ARockwell International Corporation · 1991
- Trench etch process for dielectric isolation44US 4,534,826 AIBM Corporation · 1985
- Method of manufacturing a solid-state image pickup device23US 4,608,749 AKabushiki Kaisha Toshiba · 1986
- Polyimide process for protecting integrated circuits21US 5,242,864 AIntel Corporation · 1993
- Interdigitated IMPATT devices17US 4,596,070 ATexas Instruments Incorporated · 1986