Y10S 148/062
Gold diffusion
Y10S148/062 (Gold diffusion) appears on 12 US grants and 0 published applications in this corpus.
Search patents in Y10S- Granted patents
- 12
- Published applications
- 0
- Assignees
- 8
- Inventors
- 19
- Latest grant
- 5 Apr 1994
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Method for producing semiconductor device5 Apr 1994US 5,300,453 ARohm Co., Ltd.
- Process for attaching large area silicon-backed chips to gold-coated surfaces18 Feb 1992US 5,089,439 AHughes Aircraft Company
- Die attach using gold ribbon with gold/silicon eutectic alloy cladding6 Aug 1991US 5,037,778 AIntel Corporation
- Gold diffusion method for semiconductor devices of high switching speed16 Oct 1990US 4,963,509 ASanken Electric Co., Ltd.
- Process for bonding die to substrate using a gold/silicon seed7 Mar 1989US 4,810,671 AIntel Corporation
No published applications in this class yet.
Most cited
By later US patents
- Die attach using gold ribbon with gold/silicon eutectic alloy cladding179US 5,037,778 AIntel Corporation · 1991
- Process for bonding die to substrate using a gold/silicon seed13US 4,810,671 AIntel Corporation · 1989
- Method of manufacturing photo-diodes utilizing sequential diffusion12US 4,046,609 AU. S. Philips Corporation · 1977
- Gold diffusion method for semiconductor devices of high switching speed11US 4,963,509 ASanken Electric Co., Ltd. · 1990
- Process for attaching large area silicon-backed chips to gold-coated surfaces11US 5,089,439 AHughes Aircraft Company · 1992