Process for attaching large area silicon-backed chips to gold-coated surfaces

A method for attaching a silicon chip to a substrate wherein said silicon chip has a bottom surface having a surface area and said substrate has a gold top surface, said method comprising the steps of:

• (a) placing a gold lattice structure between said silicon chip bottom surface and said gold top surface so that said silicon chip bottom surface and said gold top surface are in contact with said gold lattice structure, said gold lattice structure having a contact area with said silicon chip which is less than ten percent of the surface area of said silicon chip bottom;
• (b) scrubbing said silicon chip bottom surface against said gold lattice structure with sufficient pressure and at a sufficient temperature to form a gold/silicon eutectic liquid between said gold lattice structure and said silicon chip bottom surface;
• and
• (c) continuing to scrub said silicon chip bottom surface against said gold lattice structure and said gold top surface for a sufficient time to form a gold/silicon eutectic attachment between substantially all of said silicon chip bottom surface and said gold top surface.