Y10S 148/051
Etching
Y10S148/051 (Etching) appears on 225 US grants and 5 published applications in this corpus.
Search patents in Y10S- Granted patents
- 225
- Published applications
- 5
- Assignees
- 88
- Inventors
- 365
- Latest grant
- 11 Oct 2022
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 55 | 0 |
| 1977 | 26 | 0 |
| 1978 | 16 | 0 |
| 1979 | 8 | 0 |
| 1980 | 6 | 0 |
| 1981 | 9 | 0 |
| 1982 | 2 | 0 |
| 1983 | 0 | 0 |
| 1984 | 3 | 0 |
| 1985 | 3 | 0 |
| 1986 | 1 | 0 |
| 1987 | 5 | 0 |
| 1988 | 4 | 0 |
| 1989 | 11 | 0 |
| 1990 | 16 | 0 |
| 1991 | 10 | 0 |
| 1992 | 10 | 0 |
| 1993 | 5 | 0 |
| 1994 | 6 | 0 |
| 1995 | 3 | 0 |
| 1996 | 8 | 0 |
| 1997 | 4 | 0 |
| 1998 | 4 | 0 |
| 1999 | 4 | 0 |
| 2000 | 1 | 0 |
| 2001 | 2 | 1 |
| 2002 | 0 | 0 |
| 2003 | 1 | 1 |
| 2004 | 1 | 1 |
| 2005 | 0 | 0 |
| 2006 | 0 | 1 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 1 |
| 2022 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Etch-resistant inkjet inks for manufacturing printed circuit boards11 Oct 2022US 11,466,166 B2Agfa-Gevaert
- Method for processing a stent processed with tools containing magnetizing components24 Aug 2004US 6,780,338 B2MRI Devices Daum GmbH
- Silicon dioxide etch process which protects metals28 Oct 2003US 6,638,445 B2Micron Technology, Inc.
- Process for treating brass components to substantially eliminate leachabale lead6 Mar 2001US 6,197,210 B1Gerber Plumbing Fixtures Corp.
- Semiconductor material produced by improved etch process which protects metal6 Feb 2001US 6,184,153 B2Micron Technology, Inc.
- Etch-resistant inkjet inks for manufacturing printed circuit boards9 Sep 2021US 2021/0277267 A1Agfa-Gevaert
- Stent, method for processing stent, and method of stenting a patient7 Dec 2006US 2006/0276876 A1
- Stent, method for processing stent, and method of stenting a patient28 Oct 2004US 2004/0211491 A1
- Material for nuclear spin tomography MRI or magnetic resonance imaging (prototype)24 Apr 2003US 2003/0078675 A1MRI Devices Daum GmbH
- Silicon dioxide etch process which protects metals8 Nov 2001US 2001/0038090 A1Micron Technology, Inc.
Most cited
By later US patents
- Method for forming isolated regions of silicon utilizing reactive ion etching158US 4,104,086 AInternational Business Machines Corporation · 1978
- Method for forming solder bumps in semiconductor devices143US 5,508,229 ANational Semiconductor Corporation · 1996
- Method of manufacturing a bonded semiconductor substrate and a dielectric isolated bipolar transistor119US 5,476,813 AKabushiki Kaisha Toshiba · 1995
- RIE process for fabricating submicron, silicon electromechanical structures110US 5,198,390 ACornell Research Foundation, Inc. · 1993
- Utilizing polysilicon diffusion sources and special masking techniques103US 4,157,269 AInternational Business Machines Corporation · 1979