H10P 54/94
After-treatments
Official title: After-treatments, e.g. removal of adhesive tapes or supports
H10P54/94 (After-treatments) appears on 0 US grants and 3 published applications in this corpus.
Search patents in H10P- Granted patents
- 0
- Published applications
- 3
- Assignees
- 4
- Inventors
- 8
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2022 | 0 | 1 |
| 2023 | 0 | 0 |
| 2024 | 0 | 0 |
| 2025 | 0 | 0 |
| 2026 | 0 | 2 |
By publication year. 2026 runs to 8 Oct.
Recent patents
No granted patents in this class yet.
- Stock roll for protective film transfer, protective film arranging method, and chip manufacturing method1 Oct 2026US 2026/0305212 A1Disco Corporation
- Method for manufacturing semiconductor device24 Sep 2026US 2026/0293564 A1Kabushiki Kaisha Toshiba
- Adhesive sheet24 Nov 2022US 2022/0372349 A1Nitto Denko Corporation
Most cited
By later US patents
No patent in this class has been cited by a later US patent yet.