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  1. Technology classes
  2. /H · Electricity
  3. /H10 · Semiconductor devices
  4. /H10H · Inorganic light-emitting semiconductor devices having potential barriers
  5. /H10H 29/00 · Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting
  6. /H10H 29/80 · Constructional details
  7. /H10H 29/85 · Packages
  8. /H10H 29/858 · Means for heat extraction or cooling
  9. /H10H 29/8585
H10H 29/8585

Being an interconnection

Official title: {being an interconnection}

H10H29/8585 (Being an interconnection) appears on 4 US grants and 20 published applications in this corpus.

Search patents in H10H

Where it sits

  1. HElectricity
  2. H10Semiconductor devices
  3. H10HInorganic light-emitting semiconductor devices having potential barriers
  4. H10H 29/00Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting
  5. H10H 29/80Constructional details
  6. H10H 29/85Packages
  7. H10H 29/858Means for heat extraction or cooling
  8. H10H 29/8585Being an interconnection
Granted patents
4
Published applications
20
Assignees
16
Inventors
49
Latest grant
19 May 2026

Filings by year

Granted patentsPublished applications
H10H 29/8585: granted patents and published applications per publication year
YearGranted patentsPublished applications
200901
201000
201111
201200
201310
201400
201500
201600
201700
201800
201900
202000
202100
202200
202300
202400
2025013
202625

200920192026

By publication year. 2026 runs to 8 Oct.

Recent patents

  • Light emitting diode module and display apparatus having the same19 May 2026US 12,635,317 B2Samsung Electronics Co., Ltd.
  • Micro light emitting diode10 Mar 2026US 12,575,455 B2Rayleigh Vision Intelligence Co. Ltd.
  • Light-emitting diode chip package body and method for manufacturing same16 Jul 2013US 8,487,339 B2
  • Light-emitting diode chip package body and method for manufacturing same13 Sep 2011US 8,017,968 B2
  • Substrate for illumination device with heat dissipation wiring10 Sep 2026US 2026/0264607 A1Toyoda Gosei Co., Ltd.
  • Light emitting module and light system including the same10 Sep 2026US 2026/0271471 A1Seoul Viosys Co., Ltd.
  • Low cost segmented light-emitting die architecture for displaying images and method of manufacture25 Jun 2026US 2026/0177859 A1Lumileds LLC
  • Package structure30 Apr 2026US 2026/0123163 A1Lextar Electronics Corporation
  • Light emitting device12 Mar 2026US 2026/0076016 A1Seoul Semiconductor Co., Ltd.

Most cited

By later US patents

No patent in this class has been cited by a later US patent yet.

Top assignees

Documents
  • Nichia Corporation3
  • JBJade Bird Display (Shanghai) Limited2
  • Samsung Electronics Co., Ltd.2
  • SVSeoul Viosys Co., Ltd.2
  • AUO Corporation1
  • HVHefei Visionox Technology Co., Ltd.1
  • HAHuaian Aucksun Optoelectronics Technology Co., Ltd1
  • JOJointec Optoelectronics (Zhejiang) Co., Ltd1
  • KGKunShan Go-Visionox Opto-Electronics Co., Ltd1
  • LELextar Electronics Corporation1

Often classified with

  • H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by13
  • G02FOptical devices or arrangements for the control of light by modification of4
  • Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4
  • B60QArrangement of signalling or lighting devices, the mounting or supporting thereof or1
  • F21SNon-portable lighting devices1
  • G02BOptical elements, systems or apparatus1
  • H10DInorganic electric semiconductor devices1
  • H10KOrganic electric solid-state devices1

Documents that also carry the other class.

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