Light emitting diode module and display apparatus having the same
AssigneeSamsung Electronics Co., Ltd.
InventorsSoowung Park, Changhoon Kwak, Kyoungjun Kim
Life of this patent
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Abstract
A light emitting diode (LED) module is provided. The LED module includes: a substrate including upper pads; a passivation layer on the substrate and defining openings exposing the upper pads; an LED chip on the passivation layer and including electrode pads electrically connected to the upper pads of the substrate; an adhesive layer on the LED chip and extending along a side surface of the LED chip; and a phosphor film covering an external surface of the adhesive layer and including an end portion around the LED chip.
Claims20
A light emitting diode (LED) module comprising:
- a substrate comprising upper pads;
- a passivation layer on the substrate and defining openings exposing the upper pads;
- a plurality of LED chips on the passivation layer, wherein the plurality of LED chips comprises an LED chip, and the LED chip comprises electrode pads electrically connected to the upper pads of the substrate;
- an adhesive layer on the LED chip and extending along a side surface of the LED chip;
- and
- a phosphor film covering an external surface of the adhesive layer and comprising an end portion around the LED chip, wherein the end portion extends along the external surface of the adhesive layer to contact at least a portion of the passivation layer,
- wherein the phosphor film of the LED chip is spaced apart from phosphor films of adjacent LED chips among the plurality of LED chips.
A light emitting diode (LED) module comprising:
- a substrate comprising upper pads;
- a plurality of LED chips on the substrate, wherein the plurality of LED chips comprises an LED chip, the LED chip comprises an active surface on which electrode pads electrically connected to the upper pads are provided, and an inactive surface opposite to the active surface, and the active surface faces an upper surface of the substrate;
- an adhesive layer on the LED chip and extending along a side surface of the LED chip;
- and
- a phosphor film covering an external surface of the adhesive layer and comprising an end portion around the LED chip,
- wherein the end portion of the phosphor film extends along the external surface of the adhesive layer to contact a passivation layer on the upper surface of the substrate, and the end portion of the phosphor film extends between the upper surface of the substrate and lower surfaces of the electrode pads of the LED chip, and
- wherein the phosphor film of the LED chip is spaced apart from phosphor films of adjacent LED chips among the plurality of LED chips.
A display apparatus comprising:
- a backlight assembly comprising a substrate, upper pads on the substrate, a passivation layer on the substrate and defining openings exposing the upper pads, and a plurality of light emitting diode (LED) modules spaced apart from each other on the passivation layer;
- and
- a display panel on the backlight assembly and configured to display an image using light emitted from the plurality of LED modules,
- wherein each of the plurality of LED modules of the backlight assembly comprises:
- an LED chip on the passivation layer and comprising electrode pads;
- connection bumps in the openings of the passivation layer and electrically connecting the upper pads to the electrode pads;
- a phosphor film covering the LED chip and comprising a lower end;
- and
- an adhesive layer between the LED chip and the phosphor film,
- wherein the lower end of the phosphor film extends along an external surface of the adhesive layer to contact at least a portion of the passivation layer;
- wherein adjacent phosphor films among the phosphor film of the each of the plurality of LED modules of the backlight assembly are spaced apart from each other on the substrate.
Dependencies are inferred from the claim text.