Light-emitting diode chip package body and method for manufacturing same
OwnerYu-Nung Sheninventor
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Abstract
A light-emitting diode chip package body with an excellent heat dissipation performance and a low manufacturing cost, and a packaging method of the same are disclosed. A LED chip package body is provided, the LED chip package body comprising: a LED chip having an electrode-side surface and at least two electrodes mounted on said electrode-side surface; an electrode-side insulating layer formed on said electrode-side surface of said LED chip and formed with a plurality of through-holes registered with corresponding said electrodes; a highly heat-dissipating layer formed in each of said through-holes of said insulating layer on said electrode-side surface; and a highly heat-conducting metal layer formed on said highly heat-dissipating layer in each of said through-holes.
Claims11
A LED chip package body, comprising:
- a pair of electrode terminals;
- and
- a LED chip having a first electrode-side surface on which a first electrode is formed and a second electrode-side surface on which a second electrode is formed, said first and second electrodes having opposite conductivity, said LED chip supported by said electrode terminals in a manner that said electrodes on said first and second electrode-side surfaces electrically contact with contact of corresponding electrode terminals, said electrode-side surface of said LED chip coated with a diamond-like film.
Dependencies are inferred from the claim text.