Light-emitting diode chip package body and method for manufacturing same
OwnerYu-Nung Sheninventor
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Abstract
A light-emitting diode chip package body with an excellent heat dissipation performance and a low manufacturing cost, and a packaging method of the same are disclosed. A LED chip package body is provided, the LED chip package body comprising: a LED chip having an electrode-side surface and at least two electrodes mounted on said electrode-side surface; an electrode-side insulating layer formed on said electrode-side surface of said LED chip and formed with a plurality of through-holes registered with corresponding said electrodes; a highly heat-dissipating layer formed in each of said through-holes of said insulating layer on said electrode-side surface; and a highly heat-conducting metal layer formed on said highly heat-dissipating layer in each of said through-holes.
Claims14
A LED chip package body, comprising:
- a LED chip having an electrode-side surface and at least two electrodes mounted on said electrode-side surface, LED chip further having a main light-emitting surface opposite to said electrode-side surface;
- an electrode-side insulating layer formed on said electrode-side surface of said LED chip and formed with a plurality of through-holes registered with corresponding said electrodes;
- a heat-dissipating layer formed in each of said through-holes of said insulating layer on said electrode-side surface;
- a heat-conducting metal layer formed on said heat-dissipating layer in each of said through-holes;
- and
- a light-emitting surface-side insulating layer formed on said main light-emitting surface, said light-emitting surface-side insulating layer formed with a via reaching said main light-emitting surface;
- and a fluorescent layer formed in said via.
Dependencies are inferred from the claim text.