H10H 29/0364
Of interconnections
Official title: {of interconnections}
H10H29/0364 (Of interconnections) appears on 67 US grants and 368 published applications in this corpus.
Search patents in H10H- Granted patents
- 67
- Published applications
- 368
- Assignees
- 104
- Inventors
- 855
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2012 | 0 | 3 |
| 2013 | 1 | 0 |
| 2014 | 1 | 0 |
| 2015 | 0 | 1 |
| 2016 | 0 | 1 |
| 2017 | 1 | 1 |
| 2018 | 1 | 4 |
| 2019 | 4 | 3 |
| 2020 | 2 | 6 |
| 2021 | 2 | 7 |
| 2022 | 5 | 17 |
| 2023 | 7 | 26 |
| 2024 | 9 | 21 |
| 2025 | 24 | 141 |
| 2026 | 10 | 137 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Method of packaging and integration for multi-layer system4 Aug 2026US 12,701,843 B2Hyperlume Inc.
- Display panel and method of fabricating the same12 May 2026US 12,628,477 B2AUO Corporation
- Display device, method of manufacturing the same, and tiled display device14 Apr 2026US 12,604,648 B2Samsung Display Co., Ltd.
- Apparatus and method for transferring light-emitting diodes3 Mar 2026US 12,568,840 B2Samsung Electronics Co., Ltd.
- Method of repairing light emitting device and display panel having repaired light emitting device24 Feb 2026US 12,564,104 B2Seoul Viosys Co., Ltd.
- Manufacturing method of a led array precursor with electrical contacts on same side, corresponding precursor, led array and devices comprising the same8 Oct 2026US 2026/0314139 A1Polar Light Technologies AB
- Light-emitting element package and method for forming the same8 Oct 2026US 2026/0314152 A1Ennostar Corporation
- Manufacturing method of display device24 Sep 2026US 2026/0293391 A1Samsung Display Co., Ltd.
- Display device, manufacturing method of the same, and electronic device comprising the same17 Sep 2026US 2026/0282638 A1Samsung Display Co., Ltd.
- Display device, method for manufacturing the same and electronic device10 Sep 2026US 2026/0271451 A1Samsung Display Co., Ltd.
Most cited
By later US patents
- LED-based light source utilizing asymmetric conductors67US 8,455,895 B2Bridgelux, Inc. · 2013
- Light emitting device and fabricating method thereof44US 10,340,419 B2Samsung Display Co., Ltd. · 2019
- Fluidic assembly top-contact LED disk11US 10,115,862 B2eLux, Inc. · 2018
- Fluidic assembly top-contact LED disk6US 10,475,958 B2eLux, Inc. · 2019
- Display module having glass substrate on which side wirings are formed and manufacturing method of the same6US 11,056,630 B2Samsung Electronics Co., Ltd. · 2021