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US 12,568,840 B2Granted
Apparatus and method for transferring light-emitting diodes
AssigneeSamsung Electronics Co., Ltd.
InventorsIvan Huang, Massimo Martinelli, Eric Strasilla
Life of this patent
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Abstract
An apparatus for transferring light-emitting diodes (LEDs) includes a backing board for supporting a backplane, a sealing member formed on the backing board around a periphery of the backplane, a transparent panel formed on the sealing member such that a space is formed between the backing board and the transparent panel, and a vacuum source for drawing a vacuum on the space.
Claims10
A system comprising:
- an apparatus for transferring light-emitting diodes (LEDs), the apparatus comprising:
- a backing board configured to support a backplane;
- a sealing member located on the backing board around a periphery of a position of the backplane;
- a glass panel that is transparent, the glass panel located on the sealing member such that a space is formed between the backing board and the glass panel;
- a vacuum source configured to draw a vacuum on the space;
- and
- a laser radiation source that is configured to direct a laser radiation through the glass panel to irradiate a LED coupon on the backplane in the space,
- wherein the vacuum source is configured to draw the vacuum on the space such that the vacuum pulls the glass panel toward the backplane, thereby causing the glass panel to press the LED coupon toward the backplane,
- wherein an upper surface of the sealing member is configured to be above an upper surface of the backplane in a case where the backplane is supported by the backing board, and
- wherein the glass panel is on the upper surface of the sealing member.
7 more elements
Dependencies are inferred from the claim text.