Display device, method of manufacturing the same, and tiled display device

A method of manufacturing a display device, the method comprising:

• forming a laser absorption layer which comprises amorphous silicon, on a first substrate;
• forming a plurality of first contact holes penetrating the laser absorption layer;
• forming a first barrier insulating layer on the laser absorption layer;
• forming a plurality of second contact holes penetrating the first barrier insulating layer and overlapping the plurality of first contact holes;
• forming a plurality of pad portions disposed on the first barrier insulating layer and inserted into the plurality of second contact holes;
• forming a second barrier insulating layer on the first barrier insulating layer and the plurality of pad portions;
• forming a display layer on the second barrier insulating layer;
• forming an opening hole by etching the first substrate and exposing the plurality of pad portions and a portion of the laser absorption layer;
• and
• electrically connecting a flexible film to each of the plurality of pad portions by inserting the flexible film into the opening hole, wherein
• a portion of the first barrier insulating layer is disposed in each of the plurality of first contact holes, and
• the plurality of pad portions are electrically insulated from the laser absorption layer.

A tiled display device, comprising:

• a plurality of display devices, each comprising:
• a display area having a plurality of pixels;
• and
• a non-display area surrounding the display area;
• and
• a coupling member coupling the plurality of display devices, wherein
• at least one of the plurality of display devices comprises:
• a substrate comprising an opening hole;
• a laser absorption layer disposed on the substrate, comprising:
• amorphous silicon;
• and
• a plurality of first contact holes;
• a first barrier insulating layer disposed on the laser absorption layer and comprising a plurality of second contact holes overlapping the plurality of first contact holes;
• a plurality of pad portions disposed on the first barrier insulating layer and partially disposed in the plurality of second contact holes;
• a second barrier insulating layer disposed on the first barrier insulating layer and the plurality of pad portions;
• a display layer disposed on the second barrier insulating layer;
• and
• a flexible film disposed under the substrate, inserted into the opening hole, and electrically connected to the plurality of pad portions, wherein
• a portion of the first barrier insulating layer is disposed in each of the plurality of first contact holes, and
• the plurality of pad portions are electrically insulated from the laser absorption layer.