Method of repairing light emitting device and display panel having repaired light emitting device

A light module, comprising:

• a circuit board including first pads;
• a plurality of light emitters disposed on the circuit board and including second pads, the plurality of light emitters including a first light emitter configured to emit a first light having a first peak wavelength and a second light emitter configured to emit a second light having a second peak wavelength;
• and
• a plurality of metal bonders including a first metal bonder of the first light emitter and a second metal bonder of the second light emitter, the first and second metal bonders electrically connecting one of the first pads and one of the second pads of the first and second light emitters, respectively,
• wherein an upper surface of the second metal bonder is disposed at a level between an upper surface and a bottom surface of the first light emitter,
• wherein the first metal bonder of the first light emitter and the second metal bonder of the second light emitter include a same material, and
• wherein a distance from the upper surface to a bottom surface of the second metal bonder of the second light emitter is different from a distance from an upper surface to a bottom surface of the first metal bonder of the first light emitter.

A light module, comprising:

• a circuit board including first pads;
• a first light emitter disposed on the circuit board and having a second pad;
• a second light emitter disposed on the circuit board and having a third pad;
• a first metal bonder electrically connecting one of the first pads and the second pad;
• and
• a second metal bonder electrically connecting another one of the first pads and the third pad,
• wherein an upper surface of the second metal bonder is disposed at a level between an upper surface and a bottom surface of the first light emitter,
• wherein the first metal bonder and the second metal bonder include a same material, and
• wherein a distance from an upper surface to a bottom surface of the first metal bonder is different from a distance from the upper surface to a bottom surface of the second metal bonder.