H10F 71/139
Manufacture or treatment of devices covered by this subclass: using temporary substrates
Official title: {using temporary substrates}
H10F71/139 (Manufacture or treatment of devices covered by this subclass: using temporary substrates) appears on 815 US grants and 1,062 published applications in this corpus.
Search patents in H10F- Granted patents
- 815
- Published applications
- 1,062
- Assignees
- 343
- Inventors
- 1,531
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 4 | 0 |
| 1994 | 2 | 0 |
| 1995 | 4 | 0 |
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 2 | 0 |
| 1999 | 1 | 0 |
| 2000 | 5 | 0 |
| 2001 | 8 | 8 |
| 2002 | 7 | 4 |
| 2003 | 7 | 8 |
| 2004 | 6 | 6 |
| 2005 | 6 | 8 |
| 2006 | 3 | 9 |
| 2007 | 3 | 8 |
| 2008 | 1 | 17 |
| 2009 | 4 | 35 |
| 2010 | 11 | 72 |
| 2011 | 32 | 63 |
| 2012 | 44 | 82 |
| 2013 | 36 | 84 |
| 2014 | 60 | 60 |
| 2015 | 75 | 83 |
| 2016 | 61 | 70 |
| 2017 | 59 | 68 |
| 2018 | 54 | 60 |
| 2019 | 47 | 54 |
| 2020 | 59 | 55 |
| 2021 | 47 | 51 |
| 2022 | 51 | 49 |
| 2023 | 39 | 36 |
| 2024 | 38 | 37 |
| 2025 | 22 | 18 |
| 2026 | 12 | 17 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- CIGS solar cell with both transparency and flexibility and its manufacturing method29 Sep 2026US 12,751,108 B2Korea Institute of Science and Technology
- Integrated active silicon photonic devices and methods thereof25 Aug 2026US 12,720,903 B1Aeluma, Inc.
- Bendable materials for electromagnetic interference shielding and detection of infrared and visible radiation25 Aug 2026US 12,720,905 B2UNM Rainforest Innovations
- Highly-efficient full van der Waals 1D p-Te/2D n-Bi2O2Se heterodiodes with nanoscale ultra-photosensitive channels11 Aug 2026US 12,707,729 B2City University of Hong Kong
- Method for producing a layer of solid material21 Jul 2026US 12,690,429 B2Siltectra GmbH
- Method for Separating a Layer of Solid Material from a Workpiece8 Oct 2026US 2026/0314345 A1Siltectra GmbH
- Vertical tethers for micro-transfer printing24 Sep 2026US 2026/0293371 A1X-Celeprint Limited
- Method for manufacturing photodetector, and photodetector17 Sep 2026US 2026/0282565 A1Hamamatsu Photonics K.K.
- Bendable Materials for Electromagnetic Interference Shielding and Detection of Infrared and Visible Radiation17 Sep 2026US 2026/0282597 A1UNM Rainforest Innovations
- Short-wave dual-band infrared detector based on indium phosphide substrate and fabrication method thereof9 Jul 2026US 2026/0198105 A1Institute of Semiconductors, Chinese Academy Science
Most cited
By later US patents
- Methods and devices for fabricating and assembling printable semiconductor elements883US 7,622,367 B1The Board of Trustees of the University of Illinois · 2009
- Method of fabricating epitaxial structures827US 8,455,290 B2Masimo Semiconductor, Inc. · 2013
- Stretchable semiconductor elements and stretchable electrical circuits765US 7,557,367 B2The Board of Trustees of the University of Illinois · 2009
- Optical systems fabricated by printing-based assembly564US 7,972,875 B2The Board of Trustees of the University of Illinois · 2011
- Method for producing semiconductor substrate513US 5,854,123 ACanon Kabushiki Kaisha · 1998