H05K 7/1431
Retention mechanisms for cpu modules
Official title: {Retention mechanisms for CPU modules}
H05K7/1431 (Retention mechanisms for cpu modules) appears on 238 US grants and 119 published applications in this corpus.
Search patents in H05K- Granted patents
- 238
- Published applications
- 119
- Assignees
- 93
- Inventors
- 411
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 4 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 6 | 0 |
| 1999 | 15 | 0 |
| 2000 | 29 | 0 |
| 2001 | 40 | 4 |
| 2002 | 25 | 11 |
| 2003 | 14 | 9 |
| 2004 | 14 | 9 |
| 2005 | 7 | 7 |
| 2006 | 13 | 9 |
| 2007 | 9 | 6 |
| 2008 | 4 | 5 |
| 2009 | 2 | 6 |
| 2010 | 6 | 4 |
| 2011 | 3 | 2 |
| 2012 | 6 | 7 |
| 2013 | 3 | 3 |
| 2014 | 2 | 2 |
| 2015 | 4 | 4 |
| 2016 | 2 | 1 |
| 2017 | 1 | 1 |
| 2018 | 2 | 1 |
| 2019 | 3 | 6 |
| 2020 | 5 | 2 |
| 2021 | 4 | 5 |
| 2022 | 4 | 2 |
| 2023 | 1 | 2 |
| 2024 | 1 | 6 |
| 2025 | 2 | 3 |
| 2026 | 3 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Multi-row pluggable high-radix modules11 Aug 2026US 12,704,887 B2Hewlett Packard Enterprise Development LP
- Module mounting structure and electronic apparatus14 Jul 2026US 12,681,542 B2Lenovo (Singapore) Pte. Ltd.
- All-in-one, end-to-end, and expandable modular data centers20 Jan 2026US 12,532,428 B2Dell Products L. P.
- Floor track and mounting apparatus for modular data centers12 Aug 2025US 12,389,562 B2Dell Products L. P.
- Detent for retention of information handling resource4 Feb 2025US 12,219,726 B2Dell Products L. P.
- Module mounting structure and electronic apparatus17 Sep 2026US 2026/0277275 A1Lenovo (Singapore) Pte. Ltd.
- Systems and methods for card retention feature retrofit5 Feb 2026US 2026/0040474 A1Xilinx, Inc.
- Anti-misplug guiding module for cpu emulator insertion and alignment27 Nov 2025US 2025/0365879 A1Aivres Systems Inc.
- Module mounting structure and electronic apparatus24 Apr 2025US 2025/0130611 A1Lenovo (Singapore) Pte. Ltd.
- Motion body and coupling method thereof27 Feb 2025US 2025/0071932 A1Fivegrand International Co., Ltd.
Most cited
By later US patents
- Computer memory cards using flash EEPROM integrated circuit chips and memory-controller systems424US 5,663,901 ASanDisk Corporation · 1997
- Computer memory cards using flash EEPROM integrated circuit chips and memory-controller systems199US 6,011,741 ASanDisk Corporation · 2000
- High-density computer module with stacked parallel-plane packaging165US 6,222,739 B1Viking Components · 2001
- EMI reduction device and assembly141US 6,219,239 B1Hewlett-Packard Company · 2001
- Reversed memory module socket and motherboard incorporating same141US 6,721,195 B2Micron Technology, Inc. · 2004