Reversed memory module socket and motherboard incorporating same
AssigneeMicron Technology, Inc.
InventorsSteven J. Brunelle, Saeed Momenpour
Life of this patent
Estimating the term…
Abstract
A memory module socket having a transposed pinout allowing the socket to be mounted on the second, or reverse, surface of a motherboard and connected to circuit traces configured for mounting of a memory socket on the first, or processor, surface of the motherboard to correctly accommodate signals between the motherboard and the memory module. A motherboard having at least one memory socket mounted on the second, opposing surface enhancing access to the memory socket or sockets for insertion and removal of memory modules for testing memory modules in multimotherboard test systems. A method of converting a conventional motherboard and memory socket assembly for such testing.
Claims14
A memory socket for connection with a motherboard including a substrate having a first surface and a second surface configured to have a processor mounted on the first surface and an arrangement of conductive elements extending through the substrate from the first surface to the second surface, the memory socket comprising:
- an insulative housing;
- an elongated channel formed in the insulative housing configured for receipt of a portion of a memory module therein;
- a first set of conductive contacts arranged within the elongated channel to be operably, removably coupled with contacts on a received portion of the memory module;
- and
- a second set of conductive contacts electrically connected to the first set of conductive contacts and arranged to mate with the arrangement of conductive elements from the second surface of the substrate.
A motherboard assembly, comprising:
- a substrate having a first surface and a second, opposing surface, a plurality of traces and a plurality of conductive apertures extending from the first surface to the second, opposing surface, wherein the plurality of apertures is electrically coupled with the plurality of traces;
- a processor location on the first surface of the substrate in communication with the traces of the plurality;
- and
- at least one memory socket mounted on the second, opposing surface of the substrate wherein the at least one memory socket is configured to receive a portion of a memory module therein, the at least one memory socket and processor location being electrically connected to the plurality of conductive apertures.
Dependencies are inferred from the claim text.