Module mounting structure and electronic apparatus
AssigneeLenovo (Singapore) Pte. Ltd.
InventorsTadashi Kosuga, Makoto Hashikura
Life of this patent
Estimating the term…
Abstract
A module mounting structure includes: a cover that covers a front surface of a memory module on which a memory chip is mounted; a relay connector board that is located between a rear side of a part of the memory module where the memory chip is mounted and a substrate, and brings a large number of contact portions of the memory module and a large number of contact portions of the substrate into contact with each other by a large number of elastic pins; and a screw that fastens the cover, a module board of the memory module, the relay connector board, and the substrate in a Z direction. The cover includes a board support protruding portion that protrudes toward the substrate and abuts on the module board along the memory chip.
Claims13
A module mounting structure in which a module including a module board and a chip on the module board is mounted on a substrate, the module mounting structure comprising:
- a cover that covers a front surface of the module on which the chip is mounted;
- a relay connector board that is between a rear side of a part of the module where the chip is mounted and the substrate, and brings contact portions of the module and contact portions of the substrate into contact with each other by elastic pins;
- and
- a fastening member that fastens, in a stacking direction, the cover, the module board, the relay connector board, and the substrate that are in a stacked state,
- wherein the cover includes a board support protruding portion that protrudes toward the substrate and abuts the module board at a position along the chip.
An electronic apparatus in which a module including a module board and a chip on the module board is mounted on a substrate, the electronic apparatus comprising:
- a cover that covers a front surface of the module on which the chip is mounted;
- a relay connector board that is between a rear side of a part of the module where the chip is mounted and the substrate, and brings contact portions of the module and contact portions of the substrate into contact with each other by elastic pins;
- and
- a fastening member that fastens, in a stacking direction, the cover, the module board, the relay connector board, and the substrate that are in a stacked state,
- wherein the cover includes a board support protruding portion that protrudes toward the substrate and abuts the module board along a periphery of the chip.
Dependencies are inferred from the claim text.