H05K 7/04
On conductive chassis
Official title: on conductive chassis
H05K7/04 (On conductive chassis) appears on 50 US grants and 48 published applications in this corpus.
Search patents in H05K- Granted patents
- 50
- Published applications
- 48
- Assignees
- 49
- Inventors
- 125
- Latest grant
- 17 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 2 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 1 |
| 2010 | 1 | 1 |
| 2011 | 1 | 1 |
| 2012 | 0 | 0 |
| 2013 | 1 | 3 |
| 2014 | 2 | 6 |
| 2015 | 0 | 3 |
| 2016 | 4 | 2 |
| 2017 | 3 | 4 |
| 2018 | 5 | 4 |
| 2019 | 4 | 3 |
| 2020 | 2 | 4 |
| 2021 | 7 | 7 |
| 2022 | 4 | 2 |
| 2023 | 0 | 2 |
| 2024 | 4 | 3 |
| 2025 | 3 | 1 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electronic device including housing having dissimilar metals17 Feb 2026US 12,556,627 B2Samsung Electronics Co., Ltd.
- Liquid-cooling heat dissipation device, cabinet, and system9 Dec 2025US 12,495,527 B2Xi'an Yep Telecom Technology Co., Ltd.
- Low inductance bus assembly and power converter apparatus including the same18 Nov 2025US 12,476,556 B2Eaton Intelligent Power Limited
- Electronic apparatus1 Apr 2025US 12,263,686 B2Riso Kagaku Corporation
- Computing systems with power protection using infrared sensors15 Oct 2024US 12,117,351 B2Quanta Computer Inc.
- Electronic device and method of suppressing signal noise generated by buck-boost circuit28 May 2026US 2026/0150183 A1Inventec Corporation
- Electrical assembly12 Jun 2025US 2025/0194036 A1Lear Corporation
- Low inductance bus assembly and power converter apparatus including the same28 Nov 2024US 2024/0396466 A1Eaton Intelligent Power Limited
- Liquid-cooling heat dissipation device, cabinet, and system15 Feb 2024US 2024/0057298 A1Xi'an Yep Telecom Technology Co., Ltd.
- Electronic device including housing having dissimilar metals18 Jan 2024US 2024/0022655 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Electronic devices formed of two or more substrates connected together, electronic systems comprising electronic devices, and methods of forming electronic devices45US 8,570,798 B2Micron Technology, Inc. · 2013
- Anchor base mounting block19US 4,567,546 AAll States Plastic Mfg. Co., Inc. · 1986
- Technique for bonding a chip carrier to a metallized substrate17US 4,512,509 AAT&T Technologies, Inc. · 1985
- Holding structure of substrates12US 4,725,920 AAlps Electric Co., Ltd. · 1988
- Air temperature sensor connection assembly10US 4,143,348 AThe Bendix Corporation · 1979