Electronic devices formed of two or more substrates connected together, electronic systems comprising electronic devices, and methods of forming electronic devices

An electronic system, comprising:

• at least one processor;
• and
• at least one memory device coupled to the processor comprising:
• a first substrate comprising a plurality of nanoscale pitch magnetic tracks within the first substrate, a plurality of microscale bond pads disposed on a surface of the first substrate, each microscale bond bad of the plurality of bond pads being disposed over at least two magnetic tracks of the plurality of magnetic tracks, and at least one tunneling junction extending from at least one of the plurality of microscale bond pads to at least one magnetic track of the plurality of nanoscale pitch magnetic tracks;
• and
• a second substrate comprising support circuitry electrically connected to the plurality of microscale bond pads.

A method of forming an electronic device, comprising:

• forming nanoscale pitch circuitry of a first substrate at a first temperature;
• forming a plurality of vias extending from at least some components of the nanoscale pitch circuitry to a surface of the first substrate;
• and
• aligning at least some microscale bond pads of a plurality of microscale bond pads on the surface of the first substrate respectively over at least two components of the circuitry of the first substrate;
• forming circuitry of a second substrate at a second, higher temperature;
• and
• electrically connecting the circuitry of the second substrate to the plurality of microscale bond pads.