Liquid-cooling heat dissipation device, cabinet, and system

A liquid-cooling heat dissipation cabinet comprising:

• two front pillars near a front door of the liquid-cooling heat dissipation cabinet;
• two rear pillars near a rear door of the liquid-cooling heat dissipation cabinet;
• a chassis tray for placing a liquid-cooling heat dissipation device;
• and
• a liquid cooling mechanism used in conjunction with a condenser fixed on an exterior sidewall of the liquid-cooling heat dissipation device,
• wherein the chassis tray is fixed within an area enclosed by the two front pillars and the two rear pillars, and is secured through the two front pillars and the two rear pillars;
• the liquid cooling mechanism is fixed above the chassis tray, on one of the rear pillars on the same side as the condenser;
• the liquid-cooling heat dissipation device comprises:
• a chassis, a circuit board, an evaporator, a heat-generating electronic component, a condenser, a vapor pipeline, and a liquid pipeline;
• an exterior sidewall of the chassis is equipped with a pipeline outlet, and the exterior sidewall is an exterior wall of a side panel in contact with a chassis panel and an IO port panel of the chassis;
• the circuit board is fixed on an inner bottom surface of the chassis;
• the evaporator is fixed on the circuit board with a preset gap, forming an accommodating space with the circuit board;
• the heat-generating electronic component is mounted on the circuit board within the accommodating space, electrically connected to the circuit board and thermally connected to the evaporator;
• the condenser is fixed on the exterior sidewall where the pipeline outlet is located;
• the vapor pipeline and the liquid pipeline pass through the pipeline outlet, connecting the evaporator with the condenser;
• and
• when the heat-generating electronic component is operating, liquid inside the evaporator absorbs heat emitted by the heat-generating electronic component and vaporizes into vapor, enters the condenser along the vapor pipeline under the internal vapor pressure, and returns to the evaporator along the liquid pipeline after being cooled into liquid by the condenser;
• the liquid cooling mechanism comprises:
• a cold plate, an elastic member, an inlet pipeline, an outlet pipeline, a cold plate slide structure, an inlet manifold, and an outlet manifold;
• wherein
• the cold plate slide structure is fixed on one of the rear pillars;
• one end of the elastic member is fixed on one of the rear pillars, and is located between corresponding areas of the cold plate slide structure;
• the cold plate is fixed to an other end of the elastic member and is slidably mounted inside the cold plate slide structure, connecting to the inlet manifold through the inlet pipeline, and connecting to the outlet manifold through the outlet pipeline;
• wherein, when the cold plate is not in contact with a heat-conductive pad provided on the condenser, the elastic member is in a naturally extended state;
• when the cold plate is in contact with the heat-conductive pad provided on the condenser, the elastic member is in a compressed state, enabling the cold plate to make conductive heat transfer with the condenser through the heat-conductive pad, and assist in dissipating heat from the heat-generating electronic component inside the liquid-cooling heat dissipation device through the condenser and the evaporator within the liquid-cooling heat dissipation device.