Technique for bonding a chip carrier to a metallized substrate
AssigneeAT&T Technologies, Inc.
InventorsRoland Ellis, Jr., Brian E. Jacobs, Edward J. March, Raymond J. Newman
Life of this patent
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Abstract
A template (148), having at least one opening (152) therein, is placed in close, spaced, relation to a PCB (30). The opening (152) is circular with a small semicircular notch (154) on the periphery thereof. A chip carrier (10) is positioned in the opening (152) with one corner (22) loosely captured in the notch (154). The PCB (30), template (148) and the loosely captured chip carriers (10) are placed in a condensation soldering facility to reflow the solder. As the solder reflows the chip carrier (10) rotates slightly about the loosely captured corner (22) to self align pads (33) on the PCB (30) to leads (16) on the chip carrier (10) as the bond is being formed.
Claims2
A method of bonding leads of a substantially square chip carrier to respective bonding pads on a planar metallized substrate, a predeposited reflowable bonding material being interposed between the pads and leads;
- the method comprising the steps of:
- roughly aligning the chip carrier leads to the respective bonding pads on a first major surface of the planar substrate;
- loosely capturing a corner of the chip carrier in a notch of a circular aperture in a template overlying the substrate;
- reflowing the bonding material to self align the leads to the pads by permitting free rotation of the chip carrier about the loosely captured corner;
- and
- solidifying the material to form the bond.
Dependencies are inferred from the claim text.